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Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature

পণ্যের বিবরণ:
উৎপত্তি স্থল: গুয়াংডং, চীন
পরিচিতিমুলক নাম: Hanast
সাক্ষ্যদান: ROHS
মডেল নম্বার: এইচএন -8806 এ/বি
বিস্তারিত তথ্য
উৎপত্তি স্থল:
গুয়াংডং, চীন
পরিচিতিমুলক নাম:
Hanast
সাক্ষ্যদান:
ROHS
মডেল নম্বার:
এইচএন -8806 এ/বি
পট লাইফ (@25°C):
0.3-0.4 ঘন্টা
প্রাথমিক নিরাময় (@25°C):
2-3 ঘন্টা
সম্পূর্ণ নিরাময় (@25°C):
4-12 ঘন্টা বা (@80°C): 0.2 ঘন্টা
কঠোরতা (শোর এ):
45±5
সান্দ্রতা:
2000-3000 mPa·S (A&B)
মিশ্রণ অনুপাত:
1:1 (ওজন বা আয়তন অনুসারে)
বিশেষভাবে তুলে ধরা:

High Light

বিশেষভাবে তুলে ধরা:

Fast curing silicone potting gel

,

Two-part potting compound HN-8806

,

Room temperature cure potting gel

ট্রেডিং তথ্য
ন্যূনতম চাহিদার পরিমাণ:
1 কেজি
মূল্য:
আলোচনাযোগ্য
প্যাকেজিং বিবরণ:
50KG/সেট, 25KG/বার
ডেলিভারি সময়:
5-7 দিন
পরিশোধের শর্ত:
টি/টি 、 পেপাল
যোগানের ক্ষমতা:
100টন/মাস
পণ্যের বর্ণনা

Fast Curing Two-Part Potting Gel HN-8806A/B | 2-3 Hours Initial Cure at Room Temperature

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature 0

 

Product Overview for silicone potting compound:

Accelerate your production flow. HN-8806 A/B achieves initial cure in just 2-3 hours at 25°C, allowing parts to move quickly to the next process step. It can be further accelerated with heat (80°C/0.2 hours), making it the perfect solution for improving production efficiency.

 

Key Features for silicone potting compound:

Fast Initial Cure (2-3hr @25°C) | Heat Acceleration Possible | Suitable Pot Life | Good Flowability | 1:1 Mix Ratio.

 

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature 1

 

Technical Parameters for silicone potting compound:

Pot Life (@25°C): 0.3-0.4 hours

Initial Cure (@25°C): 2-3 hours

Full Cure (@25°C): 4-12 hours or (@80°C): 0.2 hours

Hardness (Shore A): 45±5

Viscosity: 2000-3000 mPa·S (A&B)

Mixing Ratio: 1:1 (by weight or volume)

 

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature 0

 

Product Applications for silicone potting compound:

Consumer Electronics:Power adapters, smart home controllers, power bank PCBs.

Small/Medium Batch Manufacturing:R&D pilot production, small batch orders, repair and rework.

Fast-Paced Production Lines:Potting for electronics requiring quick turnaround.

 

Usage Instructions for silicone potting compound:

1. Preparation:Have components ready for potting.

2. Mixing:Quickly weigh and mix in a 1:1 ratio, ensuring completion within the pot life.

3. Potting:Perform the potting operation promptly.

4. Curing:Place at 25°C for handling after 2-3 hours; or place in an 80°C oven for full cure in 12 minutes.

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature 3

 

Important Notes for silicone potting compound:

Plan workload accurately to ensure mixing and potting are completed within the pot life.

When using heat cure, ensure all components can withstand 80°C.

 

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

 

Fast Curing Two-Part Potting Gel HN-8806 | 2-3 Hours Initial Cure at Room Temperature 4

FAQ for silicone potting compound:

Q: Can the part be moved after initial cure?

A: Yes, after initial cure, the part has sufficient strength for careful handling and light subsequent operations.

Q: How can I cure it faster?

A: Heating at 80°C for 0.2 hours (approx. 12 mins) achieves full cure.

Q: Does the compound harden immediately after the pot life?

A: No, it begins to thicken and enter the curing stage gradually, but completion within the pot life is recommended.

Q: Does fast curing mean a shorter shelf life?

A: No, cure speed and shelf life are separate. The unmixed components have a 6-month shelf life.

Q: Can heat curing damage my components?

A: 80°C is safe for most components. Evaluate or choose room temperature cure if extremely heat-sensitive parts are present.

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