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Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer

제품 세부 사항:
원래 장소: 광동, 중국
브랜드 이름: Hanast
인증: ROHS
모델 번호: HN-5508
자세한 정보
원래 장소:
광동, 중국
브랜드 이름:
Hanast
인증:
ROHS
모델 번호:
HN-5508
이름:
블랙 포팅 에폭시
혼합비:
A : B = 5 : 1
열전도율:
0.2 마크로
색상:
투명, 검정
애플리케이션:
PCB/배터리/LED
사용자 정의:
지원하다
경도:
버팀목 D 80
특징:
불꽃 지연 단열재, 밀봉 본딩, 수분 방지
경화 시간:
25 h / 6-8H 표면 줄기, 12-16H 완전히 경화 또는 60-80 ℃ / 1.5-2H
왜곡 온도 ℃:
130-150
강조하다:

High Light

강조하다:

Power Module Epoxy Potting Adhesive

,

Circuit Board Epoxy Potting Adhesive

,

Transformer Epoxy Potting Adhesive

거래 정보
최소 주문 수량:
1kg
가격:
USD
포장 세부 사항:
25 킬로그램 /는 질주합니다
배달 시간:
5-8 일
지불 조건:
d/a, d/p, t/t
제품 설명

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer

Product description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength.

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 0

Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

 

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
  A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

 

processabili

 

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

 

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃

-30

 

 

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 1Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 2

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 3

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 4

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 5

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 6

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer 7