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High Insulation Silicone Potting Compound For Power Electronics And Transformers

High Insulation Silicone Potting Compound For Power Electronics And Transformers

Szczegóły produktu:
Miejsce pochodzenia: Guangdong, Chiny
Nazwa handlowa: Hanast
Orzecznictwo: ROHS
Numer modelu: HN-8808B
Szczegółowe informacje
Miejsce pochodzenia:
Guangdong, Chiny
Nazwa handlowa:
Hanast
Orzecznictwo:
ROHS
Numer modelu:
HN-8808B
Wygląd (mieszany):
Czarny elastomer
Proporcje mieszania (A:B)::
10:1 (wagowo)
Lepkość (A/B):
Składnik A: 2000-2800 cP, Składnik B: 20-30 cP (GB/2794-1995)
Gęstość:
1,42±0,02 g/cm3 (GB/2794-1995)
Żywotność (25°C):
40-60 minut
Czas utwardzania (25°C):
4-6 godzin (bez lepkości), 24 godziny (całkowite utwardzenie)
Twardość (Shore A):
30-40 (GB/T531-1999)
Rezystywność objętościowa::
≥5,0×10¹⁴ Ω·cm (GB/T 31838.2-2019)
Przewodność cieplna:
0,5±0,1 W/M·K (GB/T 38712-2020)
Podkreślić:

High Light

Podkreślić:

high insulation silicone potting compound

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silicone potting compound for power electronics

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potting compound for transformers

Informacje handlowe
Minimalne zamówienie:
1 KG
Cena:
Negocjowalne
Szczegóły pakowania:
22kg/zestaw (20kg A + 2kg B); 11kg/zestaw (10kg A + 1kg B)
Czas dostawy:
5-7 dni
Zasady płatności:
T/T
Możliwość Supply:
50 ton / miesiąc
Opis produktu

High Insulation Silicone Potting Compound For Power Electronics And Transformers

 

Product Overview for Silicone Potting Compound:

HN-8808B black potting compound is specially developed for high-heat-density electronic equipment. With a thermal conductivity of 0.5 W/m·K, it efficiently conducts heat away from heating components and greatly reduces their working temperature. The black formula also provides effective EMI shielding, solving both heat dissipation and EMC problems at the same time, and greatly prolongs the service life of electronic devices.

 

Key Performance Parameters for Silicone Potting Compound:

Appearance (Mixed) Black elastomer
Mix Ratio (A:B) 10 : 1 (by weight)
Viscosity (A/B) Component A: 2000-2800 cP,
Component B: 20-30 cP (GB/2794-1995)
Density 1.42±0.02 g/cm³ (GB/2794-1995)
Pot Life (25°C) 40-60 minutes
Cure Time (25°C) 4-6 hours (tack-free), 24 hours (full cure)
Hardness (Shore A) 30-40 (GB/T531-1999)
Volume Resistivity ≥5.0×10¹⁴ Ω·cm (GB/T 31838.2-2019)
Thermal Conductivity 0.5±0.1 W/M·K (GB/T 38712-2020)
Dielectric Strength ≥14 kV/mm
Dielectric Constant ≤3.5

 

 

 

 

Product Highlights for Silicone Potting Compound:

1.  Great Heat Dissipation: Superior thermal conductivity lowers temp of MOSFET, IGBT and other power parts by 10-30℃ steadily.

2.  Good EMI Protection: Efficiently weaken electromagnetic interference, upgrade overall EMC performance.

3.  Firm Adhesion: Perfect bonding with aluminum and other metals, no peeling under repeated temperature changes.

4.  All-round Environmental Resistance: Waterproof, damp-proof, dust-proof and chemical resistant, fit for harsh working environments.

5. Reliable Flame Retardance: Silicone material brings stable fire resistance, greatly boost product use safety.

 

 

 

Application Areas for Silicone Potting Compound:

1. High power LED drivers & automotive HID ballasts

2. EV on-board chargers, motor control units

3. Industrial power supplies & servo drivers

4. Solar inverters, telecom base station power modules

 

Detailed Operating Guide for Silicone Potting Compound:

1. Mix A and B components at ratio 10:1 evenly, then pour into molds as required.

2. Defoam surface bubbles, then cure naturally at room temperature.

3. Mixing ratio is adjustable as needed: higher B proportion brings faster curing speed.

 

 

 

Packaging & Storage for Silicone Potting Compound:

  • Packing Specification
     
    22kg per set (20kg A + 2kg B); 11kg per set (10kg A + 1kg B)
     
  • Storage Requirement
     
    Keep sealed in cool dry area, avoid direct sunlight. Recommended storage temperature: 10-30°C
     
  • Shelf Life
     
    6 months from production date in unopened original package

 

 

FAQ for Silicone Potting Compound:

1. Q: How does the thermal performance compare to competitors?

A: A thermal conductivity of 0.5 W/M·K is considered high for condensation-cure silicones, effectively addressing most high-heat applications. We can provide real application data for reference.

2. Q: Is it electrically conductive?

A: It is completely non-conductive. Its volume resistivity is on the order of 10¹⁴ Ω·cm, making it an excellent insulator.

3. Q: How is the adhesion to aluminum substrates? Can it pass thermal shock tests?

A: This is a core strength. Its elastomeric properties and optimized adhesion formula effectively absorb CTE mismatch between aluminum and components, passing -40°C to 125°C for 1000 cycles.

4. Q: Can this be used if my product's heat sink is plastic?

A: Yes, but confirm the plastic housing (e.g., PBT, Nylon) can withstand the long-term 200°C service temperature. We recommend compatibility and temperature testing first.

5. Q: Can you customize for higher thermal conductivity?

A: Yes. We have strong R&D capability and can offer customized formulas with thermal conductivity up to 1.0 W/M·K or higher. Please contact our engineers to discuss.

 

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