HN-8808AB is a low-viscosity, two-component condensation-cure RTV-2 silicone potting compound supplied in a 10:1 ratio. Produced by our China potting compound factory in Shenzhen, Guangdong, it flows readily into densely populated PCB assemblies and narrow sensor housings, then cures at room temperature into a transparent elastomer. The cured compound insulates, cushions vibration and forms a durable moisture barrier for sensors, automotive electronic modules and power converters.
| Property | Value |
|---|---|
| Model | HN-8808 A/B |
| Cure Type | Two-component condensation cure (RTV-2), room temperature |
| Mix Ratio (A:B) | 10:1 by weight |
| Appearance | Transparent liquid |
| Viscosity Component A (25°C) | 2200-2600 mPa·s |
| Viscosity Component B (25°C) | 20-30 mPa·s |
| Density (Component A) | 0.94 ±0.02 g/cm³ |
| Dielectric Strength | ≥14 kV/mm |
| Dielectric Constant | ≤3.0 |
| Elongation at Break | ≤100% |
| Operating Temperature | -50°C to 200°C |
| Full Cure Time (25°C) | 8-24 hours |
| Shelf Life | 6 months |
| Packaging | 22kg/set (20kg A + 2kg B) or 11kg/set (10kg A + 1kg B) |
Hanast is a direct China potting compound factory located in Guangdong, Shenzhen, with a 40,000 m² production facility. As a Shenzhen potting compound factory and Guangdong potting compound factory supplier, we support OEM and ODM customization of viscosity, hardness, adhesion and cure speed, provide an SDS on request, and supply multi-ton batches with wholesale factory-direct pricing.
Supplied as Component A (20kg or 10kg iron/plastic drum) together with Component B (2kg or 1kg plastic bottle), or as ready 10:1 kits of 22kg/set or 11kg/set. Keep components sealed in a cool, dry, ventilated place below 25°C, protected from direct sunlight and moisture. Shelf life is 6 months; best used within 3 months. Classified as non-dangerous goods for transport.
Q1: What is HN-8808AB and which applications does it suit?
A1: HN-8808AB is a low-viscosity 10:1 two-part RTV silicone potting compound. It is used for industrial sensors, automotive ECU/TCU/BMS/ADAS modules, IGBT power converters and IoT device encapsulation.
Q2: Is the viscosity low enough for fine-pitch PCBs and small sensors?
A2: Yes. Its low mixed viscosity allows self-levelling flow into fine-pitch component gaps, under BGAs and into narrow sensor housings for void-free encapsulation.
Q3: What is the mix ratio and curing schedule?
A3: Mix Component A and Component B at a 10:1 ratio by weight. The compound cures at room temperature, with full cure in 8-24 hours at 25°C. After initial cure, gentle heating not exceeding 60°C may be used to accelerate curing.
Q4: Is it suitable for automotive use and is it non-corrosive?
A4: Yes. It withstands -50°C to 200°C thermal cycling, damps vibration and cures by a neutral condensation mechanism that is non-corrosive to copper traces and metal parts, making it suitable for under-hood and in-cabin electronic modules.
Q5: Where is it manufactured and what certifications, MOQ and packaging are available?
A5: It is manufactured in our China potting compound factory in Guangdong, Shenzhen. HN-8808AB is RoHS and REACH compliant with an SDS available and is classified as non-dangerous goods, supplied in 22kg/set or 11kg/set 10:1 kits with OEM/ODM bulk supply supported.
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