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Thermal conductive potting compounds is a low viscosity flame-retardant two-component addition molding organic silicon thermal conductive potting compounds. It can be cured at room temperature or heated, and has the characteristic of curing faster at higher temperatures. Product performance Good conductivity and flame retardancy Low viscosity, good leveling performance Good insulation performance Waterproof, moisture-proof, and shockproof Good aging resistance No heat shrinkage adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Typical applications LED driver power supply Power module Bulb lamp Transformers, ballasts, inverters Automotive HID stabilizer Electronic components   Standard packaging specifications 25KG, one set per barrel A/B Storage and transportation 1. Store in a cool and dry place, with a storage period of 6 months (25 ℃). 2. This product belongs to non hazardous materials and can be transported as general chemicals

Potting compounds are generally liquid or paste-like, and these adhesives need to be cured before they can exert their bonding effect during bonding. Therefore, the curing process of adhesives is also very important. If the curing is not good, the impact on the bonding of items is very large, even if the adhesive you use is even better, it may affect the bonding effect. The curing of potting compounds is generally divided into initial curing, basic curing, and post-curing. Curing reaction is the process of obtaining and improving bonding strength and other properties through chemical reactions (polymerization, cross-linking). Curing is the key process to achieve good bonding performance. Only when fully cured can the strength be maximized. The three curing methods are as follows: 1. Initial curing: Under certain temperature conditions, after some time, reaching a certain strength, the surface has hardened and is not sticky, but the curing is not complete. 2. Basic curing: After some time, most of the reaction groups participate in the reaction and reach a certain degree of cross-linking. 3. Post-curing: To improve the bonding performance or meet the needs of the process, the treatment of the basic cured adhesive is generally carried out at a certain temperature and maintained for a period, which can supplement the curing, further improve the degree of curing, and effectively eliminate internal stress and enhance the bonding strength. To obtain a well-cured adhesive layer, the curing process must be carried out under appropriate conditions. The curing process of adhesives has a significant impact on the quality of bonding. Our company's adhesives are operated according to weight ratios. In addition to the main factor of uneven weight ratios, there are three basic process parameters during curing: temperature, pressure, and time. These three parameters also have a significant impact on the curing of adhesives. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber The three major factors affecting adhesive curing: 1. Curing time Curing time refers to the time required for the bonding process to cure under certain temperature and pressure conditions. Different adhesives also have different curing times, such as instant curing, such as a-cyanoacrylate adhesive, hot melt adhesive, which can cure for several hours, such as room temperature fast curing epoxy adhesive, and several days of curing, such as epoxy polyamide adhesive. The curing time is also affected by the curing temperature and pressure. Increasing the curing temperature can shorten the curing time. Under lower curing temperature conditions, the curing time needs to be greatly extended. If it is lower than room temperature, it may not cure for several days. 2. Curing temperature Curing temperature is one of the important parameters during adhesive curing. If the curing temperature is too high, it can easily cause the loss of adhesive or embrittlement of the adhesive layer, leading to a decrease in adhesive strength, If the curing temperature is too low and the molecular chains of the matrix are difficult to move, it will cause the crosslinking density of the adhesive layer to be too low and the curing reaction cannot be completed. Therefore, during the curing process, the curing temperature must be strictly controlled, and each adhesive has a specific curing temperature. 3. Curing pressure Curing pressure refers to the application of a certain amount of pressure during the curing process, which is conducive to the good bonding between the adhesive layer and the adherend, ensuring quality. Due to the different types of adhesive, the applied pressure is also different, generally divided into the following three situations: contact pressure is the pressure generated by the weight of the adherend for curing, without the need for additional pressure, such as epoxy resin adhesive. The pressure range of 0.1~0.3MPa is suitable for solvent-based adhesives, such as phenolic formaldehyde formaldehyde adhesive, phenolic nitrile adhesive, epoxy nitrile adhesive, epoxy nylon adhesive, and polyimide adhesive. The pressure range of 0.3~0.5MPa is suitable for various adhesives such as film, powder, tube, and particle, as well as hot melt adhesives. The purpose of increasing the pressure is to improve its wettability. Although the quality of the adhesive is important, the curing factors cannot be ignored. No matter how good the adhesive is, if the curing temperature, pressure, and time are not taken into account, it will have a significant impact on the adhesive performance. It may lead to factors such as weak adhesion of items and prolonged noncuring of adhesives, so it is important to pay attention to these factors when using adhesives.

There are many types of electronic potting compounds, and according to the material type, the three most commonly used ones are currently epoxy resin potting adhesive, organic silicon potting adhesive, and polyurethane potting adhesive. However, these three types of materials alone can be further divided into hundreds of different types and applications of products. Electronic sealing adhesive belongs to a liquid state before curing, with fluidity and viscosity of the adhesive liquid. The specific sealing adhesive operation varies depending on the material, performance, and production process of different products. When using electronic potting compounds for electronic components, it is necessary to strictly control the environmental temperature, humidity, operating vacuum, temperature, and other influencing factors to ensure the success rate of sealing. Generally speaking, during the sealing process, it is required that the ambient temperature should not exceed 25 ℃. Otherwise, the prepared rubber material is prone to vulcanization and drawing in a short period, causing inconvenience to the sealing operation. The pre-drying temperature of the filler must be controlled at around 100 ℃, and the pre-drying time is about 4 hours so that the water molecules inside the filler can fully evaporate. Otherwise, it is easy to cause the residual water molecules, which can increase the surface conductivity of the insulation material, reduce the volume resistivity, increase the dielectric loss, and lead to problems such as short circuits, leakage, or breakdown of the electrical components. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber If the sealed printed board is being sealed, the printed board needs to be cleaned before sealing and then pre-dried for moisture removal. The temperature and time for pre-drying and moisture removal can be determined based on the allowable temperature of the printed board assembly. The following temperatures can usually be selected: pre-drying temperature: 80 ℃, which takes 2 hours; Pre drying temperature: 70 ℃, which requires 3 hours; Pre drying temperature: 60 ℃, which requires 4 hours; Pre drying temperature: 50 ℃, requires 6 hours. Precautions for electronic sealing adhesive dispensing: 1. Under the condition of bottom temperature, Agent A will crystallize. Before mixing, it is necessary to heat it at 40-50 degrees for 40 minutes. 2. The glue solution prepared each time must be used up within 25-30 minutes, otherwise the viscosity will gradually increase and the fluidity will deteriorate. 3. When using a dispensing cylinder that has been dispensed with glue again, the glue inside the dispensing cylinder must be cleaned thoroughly before continuing to dispense glue, otherwise, it is easy to cause filamentous substances and poor fluidity inside the glue. Materials and tools required for sealing: Two-component electronic sealing adhesive (A component silicone and B component curing agent), measuring mixing container (plastic, glass, and other compatible containers), gloves (soft things), electronic scale (accurate to 0.1g), vacuum machine. Electronic sealing adhesive operation steps and precautions: 1. The sealed products need to be kept dry and clean; 2. When using the two-component electronic sealing adhesive, please first check Agent A to see if there is any settling, and mix Agent A thoroughly and evenly; the B agent is the same. 3. Measure correctly according to the correct mix ratio (weight ratio). If there is a significant error in the measurement of the mix ratio, the characteristics of the product will not be displayed well. 4. After mixing agents A and B, stir thoroughly and evenly again to avoid incomplete curing due to uneven mixing. A. Mix and stir agent B evenly. When mixing A and B glue, pour the less proportion into the more proportion and mix. When mixing, stir in one direction and not too fast, stirring for about 3 minutes. Stir the bottom and walls of the container evenly. If not stirred evenly, incomplete curing may occur in the later stage. The mixing container must be about three times larger than the mixing material. 5. Vacuum and remove bubbles. After complete stirring, quickly move to the vacuum box and de foam. The bubbles drawn in during stirring will cause the liquid level to rise, and after the bubbles break, the liquid level will drop again. The magnitude of vacuum degree and vacuum pumping time depend on the viscosity of the adhesive and the requirements of the product (the defoaming time is generally 2-4 minutes). If there is no vacuum machine, you can stir clockwise for 2-3 minutes. After stirring evenly, let the glue stand for 5-20 minutes to automatically defoaming. 6. After mixing evenly, the sealing adhesive should be poured in a timely manner. If the pouring operation time is too long, it can cause the sealing adhesive to solidify. 7. After pouring, it is best to shake the product so that the glue gradually penetrates into the gaps of the product, and if necessary, perform a second glue filling. After mixing, it will gradually solidify and its viscosity will gradually increase. Let it stand for a period of time and let it release bubbles. 8. Long term contact with adhesive can cause mild skin allergies and itching. It is recommended to wear protective gloves when using. If it sticks to the skin, please wipe it off with acetone or alcohol, and clean it thoroughly with a cleaning agent; Before entering the eyes, it is necessary to wash with clean water before seeking medical attention. 9. Before using it in large quantities, you can try it out in small quantities to master the product's usage skills and avoid errors. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Precautions for gluing: 1. If there is still adhesive on the surface of the product after curing, wipe the surface with a cotton cloth dipped in alcohol. 2. Try not to stick the adhesive to the surface of electronics or appliances. If it does, wipe it off immediately with a cotton cloth. 3. The equipment used for sealing should be cleaned regularly. If the pot body is used for gluing, it is necessary to ensure that there is no adhesive liquid that has already started to solidify inside the pot. Storage and shelf life: This product should be stored at room temperature for about a year, but the material must be resealed properly.

There are many types of electronic encapsulants, and based on their material types, the most commonly used are epoxy resin encapsulants, silicone encapsulants, and polyurethane encapsulants. However, these three types alone can be further divided into hundreds of different types and applications. Electronic encapsulants are liquid before curing, with fluidity and viscosity. The specific operation of encapsulation varies depending on the material, performance, and production process of different products. When using electronic encapsulants for electronic components, it is necessary to strictly control the environmental temperature, humidity, operating vacuum, temperature, and other influencing factors to ensure the success rate of encapsulation. Generally speaking, during the encapsulation process, it is required that the ambient temperature should not exceed 25 ℃. Otherwise, the prepared rubber material is prone to vulcanization and drawing in a short period, causing inconvenience to the encapsulation operation. The pre-drying temperature of the filler must be controlled at around 100 ℃, and the pre-drying time is about 4 hours so that the water molecules inside the filler can fully evaporate. Otherwise, it is easy to cause the residual water molecules, which can increase the surface conductivity of the insulation material, reduce the volume resistivity, increase the dielectric loss, and lead to problems such as short circuits, leakage, or breakdown of the electrical components.   If the sealed printed board is being sealed, the printed board needs to be cleaned before sealing and then pre-dried for moisture removal. The temperature and time for pre-drying and moisture removal can be determined based on the allowable temperature of the printed board assembly. The following temperatures can usually be selected: pre drying temperature: 80 ℃, which takes 2 hours; Pre drying temperature: 70 ℃, which requires 3 hours; Pre drying temperature: 60 ℃, requires 4 hours; Pre drying temperature: 50 ℃, requires 6 hours. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Precautions for electronic sealing adhesive dispensing: 1. Under the condition of bottom temperature, Agent A will crystallize. Before mixing, it is necessary to heat it at 40-50 degrees for 40 minutes. 2. The glue solution prepared each time must be used up within 25-30 minutes, otherwise the viscosity will gradually increase and the fluidity will deteriorate. 3. When using a dispensing cylinder that has been dispensed with glue again, the glue inside the dispensing cylinder must be cleaned thoroughly before continuing to dispense glue, otherwise, it is easy to cause filamentous substances and poor fluidity inside the glue. Materials and tools required for sealing: Two-component electronic sealing adhesive (A component silicone and B component curing agent), measuring mixing container (plastic, glass, and other compatible containers), gloves (soft things), electronic scale (accurate to 0.1g), vacuum machine. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Electronic sealing adhesive operation steps and precautions: 1. The sealed products need to be kept dry and clean; 2. When using the two-component electronic sealing adhesive, please first check Agent A to see if there is any settling, and mix Agent A thoroughly and evenly; the B agent is the same. 3. Measure correctly according to the correct mix ratio (weight ratio). If there is a significant error in the measurement of the mix ratio, the characteristics of the product will not be displayed well. 4. After mixing agents A and B, stir thoroughly and evenly again to avoid incomplete curing due to uneven mixing. A. Mix and stir agent B evenly. When mixing A and B glue, pour the less proportion into the more proportion and mix. When mixing, stir in one direction and not too fast, stirring for about 3 minutes. Stir the bottom and walls of the container evenly. If not stirred evenly, incomplete curing may occur in the later stage. The mixing container must be about three times larger than the mixing material. 5. Vacuum and remove bubbles. After complete stirring, quickly move to the vacuum box and de-foam. The bubbles drawn in during stirring will cause the liquid level to rise, and after the bubbles break, the liquid level will drop again. The magnitude of the vacuum degree and vacuum pumping time depends on the viscosity of the adhesive and the requirements of the product (the defoaming time is generally 2-4 minutes). If there is no vacuum machine, you can stir clockwise for 2-3 minutes. After stirring evenly, let the glue stand for 5-20 minutes to automatically defoam. 6. After mixing evenly, the sealing adhesive should be poured promptly. If the pouring operation time is too long, it can cause the sealing adhesive to solidify.   7. After pouring, it is best to shake the product so that the glue gradually penetrates the gaps of the product, and if necessary, perform a second glue filling. After mixing, it will gradually solidify and its viscosity will gradually increase. Let it stand for some time and let it release bubbles. 8. Long-term contact with adhesive can cause mild skin allergies and itching. It is recommended to wear protective gloves when using. If it sticks to the skin, please wipe it off with acetone or alcohol, and clean it thoroughly with a cleaning agent; Before entering the eyes, it is necessary to wash with clean water before seeking medical attention.   9. Before using it in large quantities, you can try it out in small quantities to master the product's usage skills and avoid errors. adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Precautions for gluing: 1. If there is still adhesive on the surface of the product after curing, wipe the surface with a cotton cloth dipped in alcohol. 2. Try not to stick the adhesive to the surface of electronics or appliances. If it does, wipe it off immediately with a cotton cloth. 3. The equipment used for sealing should be cleaned regularly. If the pot body is used for gluing, it is necessary to ensure that there is no adhesive liquid that has already started to solidify inside the pot. Storage and shelf life: This product should be stored at room temperature for about a year, but the material must be resealed properly.

A transformer is a device that uses the principle of electromagnetic induction to change the AC voltage, and its main components are the primary coil, secondary coil, and iron core (magnetic core). The main functions include voltage conversion, current conversion, impedance conversion, isolation, voltage stabilization (magnetic saturation transformer), etc. According to their uses, they can be divided into power transformers and special transformers (electric furnace transformers, rectifier transformers, power frequency test transformers, voltage regulators, mining transformers, audio transformers, intermediate frequency transformers, high-frequency transformers, impulse transformers, instrument transformers, electronic transformers, reactors, inductors, etc.).   adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber Different fillers determine different thermal conductivity. Transformer-specific thermal conductive silicone grease has excellent thermal conductivity, good reliability, and other advantages. At the same time, it has excellent wetting performance on copper and aluminum surfaces with low viscosity, which can fully wet the contact surface, forming a very low interfacial thermal resistance, and can quickly transfer heat to the heat dissipation device, resulting in high heat transfer efficiency. Suitable for electronic components with high requirements. Various heat dissipation devices such as high-power transistors, thyristors, frequency converter modules, etc. A good thermal conductivity channel is formed between sensitive electronic components and heat dissipation substrate, which reduces the operating temperature of the device below the critical point and greatly extends the lifespan of the components.     Notes: 1. Try to place it in a cool place and avoid direct sunlight; 2. Cover immediately after use to avoid contact with dust and other debris; 3. The application thickness of thermal conductive silicone grease should be as thin as possible when fully covered.