2025-09-09
Thermal conductive potting compounds is a low viscosity flame-retardant two-component addition molding organic silicon thermal conductive potting compounds. It can be cured at room temperature or heated, and has the characteristic of curing faster at higher temperatures.
Product performance
Good conductivity and flame retardancy
Low viscosity, good leveling performance
Good insulation performance
Waterproof, moisture-proof, and shockproof
Good aging resistance
No heat shrinkage
adhesive glue, silicone adhesive, potting compound, Potting glue, electronic potting compound, Tin cured liquid silicone, silicone rubber, rtv2 silicone, Platinum cured liquid silicone, Food grade liquid silicone, liquid silicone rubber
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Typical applications
LED driver power supply
Power module
Bulb lamp
Transformers, ballasts, inverters
Automotive HID stabilizer
Electronic components
Standard packaging specifications
25KG, one set per barrel A/B
Storage and transportation
1. Store in a cool and dry place, with a storage period of 6 months (25 ℃).
2. This product belongs to non hazardous materials and can be transported as general chemicals