HANAST HN-5508 A/B CTE Matched Thermal Cycling Resistant Epoxy Potting Compound for Motor Stator and Power Module Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for electronics exposed to repeated thermal cycling. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant.