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Thermally Conductive Potting Compound

Silicone Potting Compound for Power Modules and Switching Power Supplies (1.0 W/mK)

2026-10-13

What Is Power Module Potting?

Power module potting encapsulates power components and circuit boards in a protective silicone elastomer. A thermally conductive potting compound allows heat to escape while providing electrical insulation and environmental protection. It is widely used for switching power supplies, driver power supplies and general power modules.

Key Specifications (HN-8810A/B, 1.0 W/m·K)

Property	Value
Thermal conductivity	1.0 ± 0.1 W/m·K
Mix ratio	1:1 by weight
Mixed viscosity	2000–3000 mPa·s
Operating temperature	−40°C to 150°C
Flame retardancy	UL94 V-0
Cure	Room temperature or 80°C for 10–20 min

Why Choose 1.0 W/m·K Potting?

Balanced thermal performance and material cost;
Low viscosity for void-free filling of dense boards;
Excellent insulation and moisture protection;
UL94 V-0 flame retardancy for compliance;
Simple 1:1 mixing for high-volume production.

Frequently Asked Questions

Which potting compound suits switching power supplies? A 1.0 W/m·K addition-cure silicone such as HN-8810A/B is a good match for most supplies and power modules.

What is the mix ratio? 1:1 by weight.

Is it flame retardant? Yes — UL94 V-0.

Conclusion

For power modules and switching power supplies, thermally conductive silicone potting at 1.0 W/m·K balances heat management, insulation and cost. Shenzhen Hanast New Materials provides addition-cure potting compounds for reliable electronic encapsulation.