2026-10-13
This case study shows how a power-electronics manufacturer serving Southeast Asia improved the reliability of its power modules and LED drivers with HN-8810A/B thermally conductive silicone potting compound from Shenzhen Hanast New Materials. The 1:1 addition-cure (platinum) system combines 1.0 W/m·K thermal conductivity with excellent electrical insulation and UL94 V-0 flame retardancy.
Power modules pack high currents and heat into small housings. The producer needed a potting material that could solve several problems at once:
HN-8810A/B is a two-component addition-cure thermally conductive silicone potting compound with a simple 1:1 mix ratio by weight. It cures at room temperature or with heat acceleration (80°C for 10–20 min), and the cured elastomer keeps its rubber elasticity over a wide temperature range.
| Property | Value |
|---|---|
| Mix ratio (A:B) | 1:1 by weight |
| Mixed viscosity | 2000–3000 mPa·s |
| Thermal conductivity | 1.0 ± 0.1 W/m·K |
| Volume resistivity | ≥5.0 × 1014 Ω·cm |
| Flame retardant | UL94 V-0 |
| Operating temperature | −50°C to 200°C |
| Cure (heat accelerated) | 80°C for 10–20 min |
For power-module and LED-driver makers in Southeast Asia, HN-8810A/B delivers combined heat dissipation, insulation and moisture protection in a single easy-to-process compound. Shenzhen Hanast New Materials supports partners with samples, application guidance and technical data.