Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

HN-8830A/B is a two-component, addition-cure (platinum-catalysed) thermally conductive silicone potting compound with a thermal conductivity of 3.0 W/m·K. It is engineered for high-power electronic components that demand high heat dissipation and temperature resistance, and mixed at a 1:1 ratio by weight for simple, repeatable processing.

This B2B case study examines how a power-electronics manufacturer used HN-8830A/B to pot high-power modules, switching power supplies and driver power supplies — improving heat management and long-term reliability in demanding industrial applications.

• High heat dissipation from high-power components and modules;
• Electrical insulation for safe operation and long service life;
• Flame retardancy (UL94 V-0) for industrial and consumer electronics;
• Good fluidity and self-levelling for void-free encapsulation of dense boards;
• Reliable processing with a simple 1:1 mix and a long 60–180 min pot life.

With 3.0 W/m·K conductivity and a wide −40°C to 200°C operating range, HN-8830A/B transfers heat efficiently while staying flexible and insulating. Its UL94 V-0 rating and self-levelling flow make it suitable for high-power modules where both thermal and safety performance are critical.

1. Pre-mix: stir Component A (fillers may settle) and shake Component B until homogeneous.
2. Weighing: accurately weigh A and B in a 1:1 ratio by weight using a precision electronics scale.
3. Mixing: mix until the colour is uniform, scraping the walls and bottom.
4. Degassing: for void-sensitive parts, vacuum-degas the mixture.
5. Potting: pour into the clean, dry device within the pot life for complete coverage.
6. Curing: cure 4–8 h at 25°C or 30 min at 80°C; a two-stage cure gives the best flow/final-property balance.

• Markedly improved heat dissipation in high-power modules and supplies;
• Void-free encapsulation protected dense circuit boards and components;
• UL94 V-0 flame retardancy met industrial safety requirements;
• The long pot life supported reliable, repeatable production;
• Combined thermal, insulation and protection performance reduced field failures.

What is the thermal conductivity of HN-8830A/B? 3.0 ± 0.1 W/m·K.

What is the mix ratio? 1:1 by weight (Component A : Component B).

What is the operating temperature range? −40°C to 200°C.

Is it flame retardant? Yes — UL94 V-0.

How is it cured? Room temperature (4–8 h) or heat accelerated (30 min at 80°C).

For power-module, switching-power-supply and driver manufacturers, HN-8830A/B offers high thermal conductivity (3.0 W/m·K), UL94 V-0 flame retardancy and easy 1:1 processing. Shenzhen Hanast New Materials supports B2B partners with samples, technical data and application guidance.