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Brand Name: | Hanast |
Model Number: | HN-6607AB |
MOQ: | 1 kilogram |
Price: | Negotiable |
Packaging Details: | 25KG/ Iron Drum |
Payment Terms: | T/T |
Silicone Factory Customized High Transparent Jelly Silicon Gel 1:1 PCB Circuit Board Protection Shockproof Repairable Clear Electrical Potting Gel Glue
HN-6607AB is a very soft, low cross-linking density addition silicone rubber. It is a low-viscosity liquid before vulcanization.
Main Features:
1. Stable physical and chemical properties, with a wide temperature resistance of -60~230 ℃;
2. Low viscosity, easy to use, no solid fillers, fully transparent, and easy to observe sealing components;
3. Capable of repeated operation, repairability, high flexibility, and extremely low shrinkage rate;
4. Good dust-proof, moisture-proof, shockproof, insulation, and other performance;
5. After solidification, the surface becomes naturally sticky, enhancing the physical adhesion of most substrates without the need for a primer;
6. It can be cured at room temperature or by heating, with the characteristic of faster curing at higher temperatures, and the curing time can be freely controlled;
Characteristics before curing
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Component
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Component A
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Component B
|
Color
|
Transparent liquid
|
Transparent liquid
|
viscosity(cp s. 25℃)
|
800~2000
|
800~1800
|
Relative density(mpa•s)
|
1 .0~1.12
|
0.98~1.02
|
The mixing ratio
|
A:B=1:1
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|
Viscosity after mixing(cp s. 25℃)
|
800~1500
|
|
Operate Time (25℃)
|
2 h
|
|
Penetration (1/10mm)
|
200~ 400
|
|
Curing conditions (120℃)
|
20~30 mins
|
|
Cured properties
Hardness(Shore A, 24hr)
|
0~10
|
![]() |
Brand Name: | Hanast |
Model Number: | HN-6607AB |
MOQ: | 1 kilogram |
Price: | Negotiable |
Packaging Details: | 25KG/ Iron Drum |
Payment Terms: | T/T |
Silicone Factory Customized High Transparent Jelly Silicon Gel 1:1 PCB Circuit Board Protection Shockproof Repairable Clear Electrical Potting Gel Glue
HN-6607AB is a very soft, low cross-linking density addition silicone rubber. It is a low-viscosity liquid before vulcanization.
Main Features:
1. Stable physical and chemical properties, with a wide temperature resistance of -60~230 ℃;
2. Low viscosity, easy to use, no solid fillers, fully transparent, and easy to observe sealing components;
3. Capable of repeated operation, repairability, high flexibility, and extremely low shrinkage rate;
4. Good dust-proof, moisture-proof, shockproof, insulation, and other performance;
5. After solidification, the surface becomes naturally sticky, enhancing the physical adhesion of most substrates without the need for a primer;
6. It can be cured at room temperature or by heating, with the characteristic of faster curing at higher temperatures, and the curing time can be freely controlled;
Characteristics before curing
|
||
Component
|
Component A
|
Component B
|
Color
|
Transparent liquid
|
Transparent liquid
|
viscosity(cp s. 25℃)
|
800~2000
|
800~1800
|
Relative density(mpa•s)
|
1 .0~1.12
|
0.98~1.02
|
The mixing ratio
|
A:B=1:1
|
|
Viscosity after mixing(cp s. 25℃)
|
800~1500
|
|
Operate Time (25℃)
|
2 h
|
|
Penetration (1/10mm)
|
200~ 400
|
|
Curing conditions (120℃)
|
20~30 mins
|
|
Cured properties
Hardness(Shore A, 24hr)
|
0~10
|