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Epoxy Potting Compound

OEM Silicone Black Epoxy Potting Compound Resin Glue 5:1 For Electrical

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Thermally Conductive Potting Compound

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OEM Silicone Black Epoxy Potting Compound Resin Glue 5:1 For Electrical

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1kg
Price:	Can be discussed
Packaging Details:	30 KG per group
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong,China

Certification:

ROHS SGS

Mix Ratio:

A:B=5:1

Type:

Waterproof Epoxy Potting Glue

Feature:

No Bubbles After Curing, Smooth Surface, Luster, High Hardness

Application:

Transformers, Resistors, Filters, Temperature Sensors

Curing Time:

25℃ / 6-8H Surface Stem, 12-16H Fully Cured Or 60-80℃/1.5-2H

The Hardness Of SHORE A:

85-95

Low Temperature Resistant ℃:

A Component:

Epoxy Resin

B Component:

Curing Agent

Regular Packaging:

30 KG Per Group

Highlight:

OEM black epoxy potting compound

Electrical black epoxy potting compound

OEM electrical potting compound

Product Description

Black Epoxy Resin Potting Glue 5:1 Epoxy Silicone Manufacturer High Hardness For Circuit Board Transformers Resistors Potting Adhesive

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness

Features

Flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, low-temperature resistance.

Applications

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high-voltage packs,
aquarium equipment, anion generators, ultrasonic atomizers, and electronics

efore curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
		A sticky epoxy resin water	r liquid specific
	c gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	e Period (25℃)	Six months	x months
processabili	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	2 Tensile strength of kg/cm	16-18
	2 Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14 1.2*10
	Volume resistance ofΩ-cm	15 1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.

2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.

3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.

4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.

5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound