Electronic Grade KL-201 Liquid Hot Melt - High Peel Strength for FPC & Shielding Materials
Description:
A high-quality liquid hot melt supplier solution for the electronics industry. KL-201 provides the extreme bonding force needed for delicate electronic laminations.
Application:
Flexible Printed Circuits (FPC), EMI shielding, and copper foil lamination.
Parameters:
Viscosity 5000-10000cps; Solid Content 45±5%; Color: Yellowish
Features:
• High peeling force (4-5kg/25mm);
•Heat stable;
•Chemical resistant.
Packaging:
20kg/drum or 180kg/drum; Custom OEM packaging available.
Notes:
Protect from freezing during transport; clean equipment with water before the glue dries.
QA:
1. Q: Is it suitable for FPC?
A: Yes, it is a premier FPC lamination liquid adhesive.
2. Q: Can it handle the heat of soldering?
A: It is designed for high-temperature stability in electronic assembly.
3. Q: Is it bulk available?
A: Yes, we provide bulk liquid hot melt adhesive in 180KG drums.
4. Q: What is the solid content?
A: High solid content of 40-50% for efficient coating.
5. Q: Does it bond to PEI?
A: Yes, it is an excellent adhesive for PEI and other high-performance plastics.
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