Ultra-Soft Two-Component Low Viscosity Silicone Gel for Electromagnetic Flowmeter Junction Box Potting

Ultra-Soft Two-Component Silicone Gel for Electromagnetic Flowmeter Junction Box Potting

A very soft, low-crosslink-density two-component silicone gel engineered for stress-free potting and sealing of electromagnetic flowmeter junction boxes and other delicate electronic assemblies.

Product Overview

This two-component silicone gel is a very soft, low-crosslink-density material supplied as a low-viscosity liquid before cure. In addition to the general characteristics of moulding silicone rubber, its ultra-soft nature provides excellent moisture-proofing and sealing performance. Across a wide range of temperature and humidity, the cured gel delivers outstanding dielectric insulation. The compound cures at medium temperature, and the cure time can be adjusted by varying the cure temperature.

Key Features

• Ultra-soft, low-crosslink-density gel for stress-free protection of delicate components
• Low viscosity before cure for easy pouring and deep penetration into junction boxes
• Excellent dielectric insulation over wide temperature and humidity ranges
• Good moisture-proofing and sealing performance for outdoor and humid environments
• 1:1 mix ratio by weight for easy processing
• Medium-temperature cure; cure time adjustable by temperature
• Protects terminals, PCBs and wiring inside electromagnetic flowmeter junction boxes

Typical Applications

• Potting and sealing of electromagnetic flowmeter junction boxes
• Potting and protection of delicate electronic components requiring stress-free encapsulation
• Sensors and precision devices sensitive to mechanical stress
• Applications requiring excellent moisture sealing and dielectric insulation
• Electronic modules operating in wide temperature and humidity ranges

Technical Data - Before Mixing

Technical Data - After Mixing (A+B)

Technical Data - Cured Properties

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly manually or mechanically before use. Shake Component B well in its sealed container before use.
2. Adhesion check: When adhesion to the substrate is required, confirm compatibility and adhesion on a small sample before full-scale application.
3. Weighing: Accurately weigh Components A and B in a 1:1 ratio by weight using a precision electronic scale.
4. Mixing: Mix A and B thoroughly until uniform. Scrape container walls and bottom to ensure full dispersion.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within the pot life.
6. Curing: Allow to cure per the recommended schedule. Cure time can be adjusted by temperature. Do not move or stress the part during cure.

Recommended Curing Schedule

Precautions

• For industrial / professional use only. Wear nitrile gloves, safety goggles and protective clothing. Avoid skin and eye contact.
• Ensure adequate ventilation in the work area. Do not ingest.
• Cure inhibition warning: this addition-cure silicone may fail to cure in contact with organotin/tin-containing silicones, sulfur or polysulfide compounds, amines, polyurethane rubber, ammonia-containing items, phosphorous compounds, acidic substances (organic acids) and solder flux residues. Ensure all substrates and tools are clean and free of these contaminants.
• Do not mix or use in contact with condensation-cure (acetoxy) silicone rubber, epoxy resin or polyurethane, as these may cause cure inhibition (poisoning).
• Keep containers tightly sealed when not in use. Store away from food, children and incompatible materials.

Packaging

Storage & Shelf Life

• Store in original, tightly sealed containers in a cool, dry, well-ventilated area below 25 °C.
• Protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Products past shelf life should be inspected and tested before use.
• Transportation: classified as non-dangerous goods (general chemicals).