HN-5508AB Two-Component 5:1 Black Epoxy Potting Compound HN-5508AB is a general-purpose, two-component flame-retardant epoxy potting compound designed for sealing, encapsulating and insulating small and medium electronic components. With a moderate viscosity of 1600 ± 200 cps it flows into narrow gaps, cures at room temperature or at a moderate 60°C, and forms a smooth, glossy, bubble-free surface with Shore D 75 ± 3 hardness. The cured compound delivers UL94 V0 flame