5:1 Mix Ratio UL94 V0 Flame Retardant Black Epoxy Potting Compound for AC Capacitor and Ignition Coil Encapsulation

HN-5508AB is a general-purpose, two-component flame-retardant epoxy potting compound designed for sealing, encapsulating and insulating small and medium electronic components. With a moderate viscosity of 1600 ± 200 cps it flows into narrow gaps, cures at room temperature or at a moderate 60°C, and forms a smooth, glossy, bubble-free surface with Shore D 75 ± 3 hardness. The cured compound delivers UL94 V0 flame retardancy, 20-22 kV/mm dielectric strength, high compressive and bonding strength, and reliable acid, alkali, moisture, oil and dust resistance, making it a cost-effective protection solution for high-volume production lines.

•  Moderate 1600 cps viscosity with good fluidity for narrow-gap penetration
•  Room-temperature cure (8-12 h) or heat-accelerated cure at 60°C in 2 hours
•  Bubble-free, smooth and glossy surface with Shore D 75 ± 3 hardness
•  UL94 V0 flame retardancy and 20-22 kV/mm dielectric strength
•  Acid, alkali, moisture, waterproof, oil-proof and dust-proof performance
•  Resistance to humid-heat ageing and atmospheric ageing
•  Compressive strength 20-23 kg/cm² and high bonding strength
•  100% solids, solvent-free, EU RoHS compliant, 6-month shelf life

Suitable for potting, sealing, encapsulation protection, insulation and moisture-proofing of electronic components and assemblies, including:

•  AC capacitors
•  miniature transformers
•  transformers
•  power supply modules
•  negative-ion generators
•  aquarium pumps
•  ultrasonic atomizers
•  ignition coils
•  electronic controllers
•  LED drivers
•  sensors and transducers
•  PCB assemblies
•  relay and timer modules
•  smart meters
•  EV on-board chargers
•  BMS boards
•  charging piles
•  solar inverter combiner boxes
•  5G RRU power units
•  telecom equipment
•  rail transit control boards
•  aerospace avionics modules
•  security camera modules
•  HVAC controllers
•  agricultural control boxes
•  mining electronics
•  underwater lights
•  digital tube displays
•  stage lighting drivers
•  solenoid coils
•  temperature controllers
•  medical device boards
•  weighing instrumentation

Note: not recommended for products with elastic or soft outer shells that require flexible potting.

All values measured at 25°C / 60% RH after the recommended cure schedule; for reference only.

1.   Pre-mix: stir Component A before use, as fillers may settle; preheat A to 30-50°C in cold weather.
2.   Weighing: weigh A and B at exactly 5:1 by weight, never by volume.
3.   Mixing: mix thoroughly with a flat-bladed tool or small mixer, scraping the container walls 2-3 times.
4.   Degassing (recommended): vacuum degas to -0.1 MPa to remove mixing air and improve penetration.
5.   Pouring: preheat the parts to 80-90°C for 2 hours or more to remove moisture, then pour within the pot life in a dust-free area.
6.   Curing: cure per the schedule below without moving or stressing the parts.

•  Factory-direct supply from Guangdong, China with stable 50 tons per month capacity
•  Own laboratory: TDS and MSDS for every grade, batch-to-batch consistency
•  OEM / ODM service: custom colour, hardness, viscosity, packing and private label
•  Free samples for evaluation, MOQ from 1 kg, export-grade leak-proof packaging
•  Full epoxy, silicone and polyurethane potting range for power, automotive and industrial electronics

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

Q: What is the mixing ratio and pot life of HN-5508AB?
A: HN-5508AB is mixed at 5:1 by weight (not by volume). Pot life is 30-40 minutes at 25°C for a 100 g mix, which leaves enough working time to pot a full batch of small components.

Q: Does it cure at room temperature or does it need an oven?
A: Both options are available. At 25°C the compound reaches full cure in 8-12 hours with a 6-8 hour tack-free time; for faster output it can be cured at 60°C in 2 hours.

Q: Is it suitable for AC capacitors, miniature transformers and ignition coils?
A: Yes. At 1600 ± 200 cps the uncured resin penetrates narrow gaps between windings and capacitor cans, and the cured compound provides 20-22 kV/mm dielectric strength, UL94 V0 flame retardancy and strong bonding to plastic, metal and PCB substrates.

Q: How do I avoid bubbles and voids in the potting layer?
A: Preheat the parts to 80-90°C for at least 2 hours to drive off moisture, degas the mixed resin under vacuum down to -0.1 MPa, then pour within the pot life. The cured surface is smooth, glossy and bubble-free.

Q: What certifications, MOQ and OEM support do you offer?
A: The compound complies with the EU RoHS Directive and the cured material is rated UL94 V0. TDS, MSDS and free samples are available, MOQ starts at 1 kg, and OEM/private-label packing with custom colour or hardness can be produced in our own factory.

Need a data sheet, a free sample or a custom formulation for your AC capacitor, ignition coil or aquarium pump line? Send us your drawing and annual volume - our engineers will reply within 12 hours with a recommended grade and packing plan.