Fast Cure Silicone Potting Compound HN-8806A/B: 12 Min at 80 C for Capacitor, Transformer and Power Module Encapsulation HN-8806A/B is a two-component addition-cure silicone potting compound supplied at a 1:1 mix ratio by weight. Mixed material can be processed on manual pots or meter-mix dispensing lines and cures in only 12 minutes at 80 C, or in 2-3 hours at 25 C, into a grey elastomer of Shore A 45 ± 5. The cured compound delivers 0.76 W/m·K thermal conductivity, 1.0 ×
Waterproof clear epoxy potting compound 5:1 provided a rock-solid, crystal-clear encapsulation for our underwater sensors. Zero water leakage reported after field testing at 50 meters depth.
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