12 Min at 80 C Heat Accelerated 1:1 Mix Ratio Halogen-Free UL 94 V-0 Silicone Potting Compound for Capacitor Transformer Module Encapsulation

Fast Cure Silicone Potting Compound HN-8806A/B: 12 Min at 80 C for Capacitor, Transformer and Power Module Encapsulation

HN-8806A/B is a two-component addition-cure silicone potting compound supplied at a 1:1 mix ratio by weight. Mixed material can be processed on manual pots or meter-mix dispensing lines and cures in only 12 minutes at 80 C, or in 2-3 hours at 25 C, into a grey elastomer of Shore A 45 ± 5. The cured compound delivers 0.76 W/m·K thermal conductivity, 1.0 × 10¹⁶ Ω·cm volume resistivity, 25-30 kV/mm dielectric strength and a −50 C to 250 C service range, so capacitors, transformers, power modules and control boards can be encapsulated, insulated and heat-sinked in one step.

Key Features

• 80 C / 12 min heat accelerated cure - high-volume lines reach full cure in 12 minutes at 80 C while room-temperature cure in 2-3 hours stays available for low-volume or repair work.
• 1:1 mix ratio by weight - simple weighing or meter-mix processing, 2000-3000 mPa·s on both components for fast flow around dense component arrays.
• Halogen-free UL 94 V-0 flame retardancy - V-0 classification with RoHS and REACH compliance for EU and North American OEM documentation sets.
• 0.76 W/m·K thermal conductivity - moves heat from capacitor cans, transformer cores and power devices into housings and heat sinks.
• 25-30 kV/mm dielectric strength - 1.0 × 10¹⁶ Ω·cm volume resistivity isolates high-voltage terminals, busbars and coil windings.
• Non-corrosive, no heat and no by-products during cure - addition cure releases no exotherm, solvent or corrosive by-product, so sealed components and solder joints are not attacked.
• Extremely low cure shrinkage, low stress - protects fragile ceramic capacitors, ferrite cores, reed relays and fine solder joints during thermal cycling.
• Deep-section curing - thick capacitor banks and large transformer castings cure through the section without voids.
• Bulk kit supply - Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per set, with TDS, MSDS, RoHS and REACH declarations and batch COA.

Processing on Manual Pots and Meter-Mix Lines

1. Pre-mix - stir Component A and Component B separately before use, because fillers may settle in storage; reseal containers immediately after use.
2. Weigh or meter - weigh A and B at exactly 1:1 by weight on a precision scale, or run the pair through a 1:1 meter-mix dispenser.
3. Mix - mix in one direction and scrape the container walls and bottom; uneven mixing causes local incomplete cure.
4. Degas (optional) - vacuum degas for void-sensitive capacitor, transformer and IGBT assemblies.
5. Pot - pour or dispense within the 18-24 minute pot life at 25 C and ensure full coverage of terminals and windings.
6. Cure - 12 minutes at 80 C on heat-accelerated lines, or 2-3 hours at 25 C; do not move or stress the part during cure.

Application Coverage

HN-8806A/B is specified for insulation, moisture proofing, thermal management and mechanical protection in the following assemblies:

Capacitor and wound components

• Capacitor potting - film capacitor, electrolytic capacitor bank, snubber capacitor and power capacitor encapsulation, including deep cans that must cure without voids.
• Transformer and reactor - transformer, inductor, reactor, choke and coil winding encapsulation for power supplies and filter stages.

Power electronics and converters

• Power module - IGBT module, MOSFET module, SiC power device, thyristor and diode bridge protection with heat transfer to the cold plate.
• Converter and inverter - DC-DC converter, OBC, motor drive, servo drive, PV inverter and wind power converter power stage.
• Power supply - switching power supply, industrial power supply, UPS module and adapter boards.

Energy and transport

• EV battery and charging - battery pack, battery module, BMS board, charging pile, charging station and charging module encapsulation.
• Energy storage - ESS battery cabinet, PCS power board and BESS thermal management assemblies.
• Rail transit - traction converter control board, auxiliary power unit board and trackside signalling electronics.
• Wind power and marine - wind turbine converter board, nacelle control electronics, offshore and marine power unit, deck control box.

Industrial and general electronics

• Sensor and controller - proximity sensor, pressure transducer, temperature sensor, PLC module and industrial controller board.
• PCB and circuit board - PCBA, connector, terminal block, relay and general board encapsulation.
• Lighting and appliances - LED driver, LED power supply, household appliance control board and smart device module.
• Motor and pump - motor stator, coil encapsulation and submersible pump electronics.

Technical Data (TDS HANAST-TDS-004 Rev.1)

Before Mixing (Uncured Components)

After Mixing (A + B)

Cured Properties

Values are measured at 25 C and 50-60% RH after the recommended cure schedule and are for reference only.

Cure Inhibition Notice

This addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.

Packaging, Bulk Supply and Documentation

• Standard bulk kit - Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per A+B set.
• Pallet and export packing - barrels palletised and strapped for sea and air freight; private label and drum marking available.
• Documentation - technical data sheet (TDS), MSDS, RoHS and REACH declarations and batch COA issued with every shipment.
• Production scale - supplied from an ISO 9001 factory in Shenzhen, Guangdong, China with 50 tons per month capacity.
• Stock and lead time - stock sets ship in 3-7 working days, bulk production in 10-15 days.
• Storage - 6 months shelf life at 25 C in original sealed containers, protected from sunlight and moisture.
• Transport - classified as non-dangerous goods (general chemicals), packed to prevent leakage.

FAQ

About Hanast

Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone materials at its Guangdong base and supplies addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements.