Silicone Manufacturer Waterproof Silicone Potting Compound High Thermal Conductivity 1:1 Potting Glue Adhesive For Led Driver Power Module Battery Inverter
Description of silicone potting compound for electronics
HN-8806, two-component addition type silicone potting rubber which can be cured into high-performance elastomer by room temperature or heating
Product Features of silicone potting compound for electronics
Excellent electrical insulation, high moisture resistance, and a wide temperature range of -50°C to 250°C.
Low-viscosity potting compound that Will cure in deep sections. Low shrinkage rate after curing,
will not emit heat and by-products, no corrosion for filling and sealing components
Good thermal conductivity
Technical Parameters of silicone potting compound for electronics:
| |
Test Items |
Test Standard |
Units |
Product test results |
| Part A |
Part B |
|
Before
Curing
|
1 |
Appearance |
By eyes |
--- |
Grey, fluid |
White, fluid |
| 2 |
Viscosity |
GB/T10247- 2008 |
25ºC,mPa·S |
4500~5000 |
4500~5000 |
| 3 |
Density |
GB/T 13354-92 |
25ºC,g/cm3 |
1.50±0.05 |
1.50±0.05 |
| 4 |
Mixing Ratio (A : B) |
1:1 |
Weight ratio |
100 |
100 |
| Volume ratio |
100 |
100 |
| 5 |
Operating time |
Measured |
hr |
0.3-0.4 |
| 6 |
Curing condition |
Measured |
hr |
4~12
(25ºC, initial cure)
|
|
0.20
(80ºC)
|
|
After
Curing
|
7 |
Appearance |
By eyes |
--- |
Grey Elastomer |
| 8 |
Hardness |
GB/T 531.1-2008 |
Shore A |
50±5 |
| 9 |
Thermal conductivity |
GB/T10297-1998 |
w/m·k |
≥0.76 |
| 10 |
Expansivity |
GB/T20673-2006 |
µm/(m,ºC) |
210 |
| 11 |
Moisture Absorption |
GB/T 8810-2005 |
24h,25ºC,% |
0.01~0.02 |
| 12 |
Volume resistivity |
GB/T 1692-92 |
(DC500V),Ω· cm |
1.0×1016 |
| 13 |
Dielectric intensity |
GB/T 1693-2007 |
Kv/mm(25ºC) |
18~25 |
| 14 |
Temperature Resistance |
Measured |
ºC |
-50~+250 |
* UV-94 Fire retardant: After two times 10s burn tests on a 3mm-thick sample, the flame was extinguished within 30s, and no burnt fell. [1]
* Noted: The data after curing are all measured after the silicone is completely cured.
Application of silicone potting compound for electronics
How to use silicone potting compound for electronics
1. When used, weigh A and B according to proportion and then mix them evenly.
Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done.
It can also be sealed under a vacuum after removing the bubbles.
2. The surface of the potting element needs to be cleaned.
If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).
3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.
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