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Thermally Conductive Potting Compound 2.0W/mK UL94 V-0 Silicone Encapsulant for EV Battery Module Heat Dissipation

Name: Thermally Conductive Potting Compound 2.0W/mK UL94 V-0 Silicone Encapsulant for EV Battery Module Heat Dissipation
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8820
Availability: InStock

Ürün detayları:

Menşe yeri:	Guangdong, Çin
Marka adı:	Hanast
Sertifika:	ROHS, REACH, UL94 V-0, ISO 9001
Model numarası:	HN-8820

Ayrıntılı Bilgiler

Menşe yeri:

Guangdong, Çin

Marka adı:

Hanast

Sertifika:

ROHS, REACH, UL94 V-0, ISO 9001

Model numarası:

HN-8820

Karışım oranı:

1: 1 (a: b)

Isı İletkenliği:

2,0 W/mK

Alev Geciktirici:

UL94 V-0

Viskozite (Karışık):

5000-8000 cps

Sertlik:

45-50 Sahil A

Dielektrik dayanım:

>25 kV/mm

Hacim Direnci:

>5,0E14 Ohm·cm

Karışım Ömrü (25°C):

6-12 Ay

Kürleşme Süresi (25°C):

4-6 Saat

Sıcaklık Aralığı:

-40 ℃ ~ 150 ℃

Raf ömrü:

6 ay

Vurgulamak:

High Light

Vurgulamak:

2.0W/mK EV Battery Potting Compound

UL94 V-0 EV Silicone Encapsulant

Battery Module Thermal Management Encapsulant

Ticaret Bilgisi

Min sipariş miktarı:

1 kilogram

Fiyat:

Anlaşılabilir

Ambalaj bilgileri:

50KG/Set (Bölüm A: 25KG + Kısım B: 25KG Tambur)

Teslim süresi:

5-7 gün

Ödeme koşulları:

T/T

Yetenek temini:

Ayda 500000 kilogram

Ürün Tanımı

Thermally Conductive Potting Compound 2.0W/mK UL94 V-0 Silicone Encapsulant for EV Battery Module Heat Dissipation Product Overview HN-8820 is a high-performance two-part addition-cure silicone potting compound engineered specifically for EV battery module heat dissipation, energy storage systems, and power electronics. This RTV-2 silicone encapsulant delivers 2.0W/mK thermal conductivity with UL 94 V-0 flame retardant certification, providing critical thermal management to

Etiketler:

Thermally Conductive Potting Compound 2.0W/mK UL94 V-0 Silicone Encapsulant for EV Battery Module Heat Dissipation

High Light

Vurgulamak:

2.0W/mK EV Battery Potting Compound

UL94 V-0 EV Silicone Encapsulant

Battery Module Thermal Management Encapsulant

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