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Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Q: What should I do if the test cracks after hot and cold shock?

2025-10-14

Latest company case about Q: What should I do if the test cracks after hot and cold shock?

Answer: The CTE (thermal expansion coefficient) of the material does not match the components and PCB, and the material modulus is too high (too hard). Select a glue with good CTE matching, low modulus and high elasticity (such as silicone).