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Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation

Name: Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8820
Availability: InStock

Productdetails:

Plaats van herkomst:	Guangdong, China
Merknaam:	Hanast
Certificering:	ROHS, SGS, UL94 V-0
Modelnummer:	HN-8820

Gedetailleerde informatie

Plaats van herkomst:

Guangdong, China

Merknaam:

Hanast

Certificering:

ROHS, SGS, UL94 V-0

Modelnummer:

HN-8820

Mengverhouding:

1: 1 (a: b)

Thermische geleidbaarheid:

2,0±0,1 W/m·K

Viscositeit:

5000-8000 cP

Hardheid:

45-55 oever A

Bedrijfstijd (25℃):

1-2 uur

Uithardingstijd (25℃):

2-4 uur

Vlamvertragend:

UL94 V-0

Volumeweerstand:

5,0×10¹⁴Ω·cm

Temperatuurbereik:

-40℃ ~ 150℃

Kleuropties:

Grijz/Zwart/Wit

Houdbaarheid:

6 maanden

Markeren:

High Light

Markeren:

2.0W/m·K Thermal Conductive Potting Compound

UL94 V-0 Flame Retardant Encapsulant

New Energy Module Heat Dissipation Silicone

Handelsinformatie

Min. bestelaantal:

50 kg

Prijs:

Onderhandelbaar

Verpakking Details:

50 kg/set (deel A: 25 kg + deel B: 25 kg)

Levertijd:

5-7 dagen

Betalingscondities:

T/T

Levering vermogen:

100 ton per maand

Productbeschrijving

Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation Thermally Conductive Potting Compound HN-8820 HN-8820 is a two-component addition-cure silicone potting compound engineered for high-performance thermal management in new energy applications. Delivering an exceptional thermal conductivity of 2.0 W/m·K and UL94 V-0 flame retardancy, it provides reliable encapsulation and heat dissipation for power electronics

Taggen:

Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation

High Light

Markeren:

2.0W/m·K Thermal Conductive Potting Compound

UL94 V-0 Flame Retardant Encapsulant

New Energy Module Heat Dissipation Silicone

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