Flame Retardant Epoxy Potting Compound For Safety Critical Industrial Electronics
Description of Epoxy Potting Compound
Epoxy potting compounds are thermosetting encapsulants with epoxy resin as the base material, compounded with curing agents, inorganic fillers and functional additives. They fall into two main categories: two-part room-temperature cure systems and single-part heat-cure systems.
Commonly adopted for electronic transformers, NEV electronic control units, and 5G base station power modules, these materials shield circuit components against moisture ingress, mechanical vibration and high-voltage breakdown.
Matters need attention
1. This product is AB agent, according to the labelratio on the product package, and the mixing ratio is
weight ratio and non-volume ratio.
2, AB agent can not be mixed with a round bar
without resistance, must be stirred with a flat tool with
resistance, it is best to use a small mixer
3. This product should be placed in a cool and dryplace to avoid light, keep the workshop dust-free, and
cover the unused glue in time
4. The performance test data is the test result whenthe humidity is 60% and the temperature is 25 C, for
customer reference only.
5, Epoxy Potting Compound stored in a wet
environment will appear crystallization phenomenon
please put in the oven at low temperature hot drying
restore its original state.
Storage and transportation
1. Store in a cool and dry place with a storage periodof 6 months (25C below).
2. Products beyond the storage period should be
confirmed whether there are any abnormalities before
being used.
3. Parts A and B of the colloid must be sealed and
preserved, with careful leakage during transportation
4. This kind of products are non-dangerous goods
and can be transported as general chemicals.
Packing specifications
This product is 30 KG per group; including group A25 KG (barrel) and group B 5 KG (pot)
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