|
| उत्पत्ति के प्लेस: | गुआंग्डोंग, चीन |
| ब्रांड नाम: | Hanast |
| प्रमाणन: | ROHS，SGS |
| मॉडल संख्या: | एचएन-5508ए/बी |
5:1 Epoxy Resin Potting Waterproof Black Epoxy Potting Compound For Sensor PCB Transformer
Description of Epoxy Potting Compound
Epoxy potting compound is a liquid encapsulant based on epoxy resin, formulated with functional additives and curing agents. It is primarily used for insulation potting, moisture-proof sealing, and protection of electronic components. Once cured, it forms a rigid, high-hardness insulator.
technical parameter of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product Features of epoxy potting compound:
Superior Insulation: Possesses extremely high volume resistivity and dielectric strength, effectively preventing electrical leakage. Physical Protection: Upon curing, it exhibits excellent resistance to water, moisture, dust, and vibration. Chemical Resistance: Demonstrates strong tolerance to acids, alkalis, salt spray, and most solvents.
Application of epoxy resin potting:
How to use epoxy potting compound:
1. Prepare – Ensure the component is clean and dry. Stir Part A (resin) thoroughly before use.
2. Mix by Weight – Use a precise scale. The ratio 5:1 is by weight, not volume. Example: 500g Part A + 100g Part B.
3. Stir Gently – Mix slowly in one direction for 3–5 minutes. Avoid fast stirring to prevent air bubbles.
4. Remove Bubbles (Critical) – Best: use a vacuum chamber (3–5 min). Alternative: let the mix sit for 15–30 minutes to allow bubbles to rise.
5. Pour Slowly – Fill the component in one go or in two layers (recommended) to reduce voids.
6. Cure – At 25°C (77°F), allow 24 hours. For faster results, cure at 60–80°C (140–176°F) for 2–4 hours.
25kg/barrel
Pot life: ~20–40 minutes. Work quickly.
Start with a small test batch before potting valuable parts.
Wear gloves. Clean spills with alcohol or acetone.
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