5:1 Epoxy Resin Potting Waterproof Black Epoxy Potting Compound For Sensor PCB Transformer
Description of Epoxy Potting Compound
Epoxy potting compound is a liquid encapsulant based on epoxy resin, formulated with functional additives and curing agents. It is primarily used for insulation potting, moisture-proof sealing, and protection of electronic components. Once cured, it forms a rigid, high-hardness insulator.
technical parameter of epoxy potting compound:
| efore curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30 |
Product Features of epoxy potting compound:
Superior Insulation: Possesses extremely high volume resistivity and dielectric strength, effectively preventing electrical leakage. Physical Protection: Upon curing, it exhibits excellent resistance to water, moisture, dust, and vibration. Chemical Resistance: Demonstrates strong tolerance to acids, alkalis, salt spray, and most solvents.
Application of epoxy resin potting:
Applications Across Electronics, Electrical, Automotive & New Energy:
- Power Modules: Potting and thermal management for transformers, chargers, and inverters.
- Sensors: Waterproof sealing for automotive sensors and industrial probes.
- PCBs: Security, corrosion resistance, and mechanical reinforcement for sensitive components.
How to use epoxy potting compound:
1. Prepare – Ensure the component is clean and dry. Stir Part A (resin) thoroughly before use.
2. Mix by Weight – Use a precise scale. The ratio 5:1 is by weight, not volume. Example: 500g Part A + 100g Part B.
3. Stir Gently – Mix slowly in one direction for 3–5 minutes. Avoid fast stirring to prevent air bubbles.
4. Remove Bubbles (Critical) – Best: use a vacuum chamber (3–5 min). Alternative: let the mix sit for 15–30 minutes to allow bubbles to rise.
5. Pour Slowly – Fill the component in one go or in two layers (recommended) to reduce voids.
6. Cure – At 25°C (77°F), allow 24 hours. For faster results, cure at 60–80°C (140–176°F) for 2–4 hours.
Package of epoxy potting compound:
25kg/barrel
Precautions & Handling Instructions of epoxy potting compound:
-
Pot life: ~20–40 minutes. Work quickly.
-
Start with a small test batch before potting valuable parts.
-
Wear gloves. Clean spills with alcohol or acetone.
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