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Epoxy Potting Compound

ODM 3:1 Clear Resin Epoxy Potting Compound Glue For LED Driver 2 Parts

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Thermally Conductive Potting Compound

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ODM 3:1 Clear Resin Epoxy Potting Compound Glue For LED Driver 2 Parts

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	Negotiable
Packaging Details:	25KG/barrel
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Certification:

ROHS SGS

Color:

Clear

Mix Ratio:

Operating Temperature Range:

-40°C To 130°C

Viscosity:

5000-10000 Cps

Dielectric Strength:

500 V/mil

Density:

1.71±0.05，g/cm3

Specific Gravity:

Shelf Life:

1 Year

Hardness:

Shore D 85

Appearance:

Semi-solid

Pot Life:

30 Minutes

Thermal Conductivity:

1.2 W/mK

Chemical Resistance:

Excellent

Cure Time:

24 Hours

Tensile Strength:

5000 Psi

Highlight:

ODM Epoxy Potting Compound

Clear Epoxy Potting Compound

ODM clear potting compound

Product Description

3:1 Epoxy Resin Potting Glue for LED Driver Transformers Resistors Power Module High Hardness 2 Parts Transparent Potting Glue Compound

Product Description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness

Main Features:

Flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance

Before curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
		A sticky epoxy resin water	r liquid specific
	c gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	e Period (25℃)	Six months	x months
processabili	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	2 Tensile strength of kg/cm	16-18
	2 Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14 1.2*10
	Volume resistance ofΩ-cm	15 1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Applications:

ODM 3:1 Clear Resin Epoxy Potting Compound Glue For LED Driver 2 Parts 1

ODM 3:1 Clear Resin Epoxy Potting Compound Glue For LED Driver 2 Parts 2

storage and transportation

1. Store in a cool and dry place with a storage period of 6 months (25℃).

2. Products beyond the storage period should be confirmed whether there are any abnormalities before being used.

3. Parts A and B of the colloid must be sealed and preserved, with careful leakage during transportation!

4. These kinds of products are non-dangerous goods and can be transported as general chemicals.

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

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