Transformer Epoxy Potting Compound For Temperature Sensors Controllers 85 95 Hardness Fire Retardant High Temp Electronic Potting Ab Glue Two Component Potting Adhesive
Product Description of Epoxy Potting Compound:
HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness
Technical Parameter of Epoxy Potting Compound
| uring |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30 |
Product Feature of Epoxy Potting Compound:
With low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength.
Note:
(1)This product is AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.
(2) AB agent can not be mixed with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.
(3) This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue in time.
(4) The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.
(5)Epoxy Potting Compound stored in a wet environment will appear crystallization phenomenon, please put in the oven at low temperature hot drying, restore its original state.
Product application of Epoxy Potting Compound
I. Power Supply and Energy Products
II. Automotive Electronics Products
III. Industrial Control and Automation Products
IV. Consumer Electronics and Home Appliance Products
V. Communication and Networking Equipment Products
Packing specifications of epoxy potting compound:
This product is 30 KG per group; including group A 25 KG (barrel) and group B 5 KG (pot)
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