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Epoxy Potting Compound

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

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Thermally Conductive Potting Compound

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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	Negotiable
Packaging Details:	25KG/barrel
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Certification:

ROHS SGS

Hardness:

Shore D 80

Electrical Insulation:

Operating Temperature:

-40°C To 150°C

Flame Retardant:

UL 94 V-0

Thermal Conductivity:

0.8 W/m·K

Dielectric Strength:

500 V/mil

Chemical Resistance:

Excellent

Cure Time:

24 Hours

Density:

1.71±0.05，g/cm3

Color:

Transparent

Shrinkage:

Less Than 0.1%

Viscosity:

1000 Cps

Appearance:

Liquid

Mix Ratio:

Adhesion Strength:

500 Psi

Highlight:

potting epoxy resin Raw Material

RTV 2 potting epoxy resin

clear potting compound Raw Material

Product Description

Factory Supply Two-Component 10:1 Silicone Encapsulant Waterproof RTV-2 Silicone Potting Rubber Non-corrosive Potting Material For LED Driver

PRODUCT DESCRIPTION

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

* Product Application *

Widely used in sealing, electrical, potting, insulation, antifouling, waterproof, shockproof, coating, electronic appliances, and comprehensive household appliances.

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver 0

fore curing	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
		A sticky epoxy resin water	r liquid specific
	c gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	e Period (25℃)	Six months	x months
processabili	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	2 Tensile strength of kg/cm	16-18
	2 Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14 1.2*10
	Volume resistance ofΩ-cm	15 1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver 1

* How to use *

According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

* Packing *

Part A: 10KG / 20KG Plastic Barrel

Part B: 1KG Plastic Barrel

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

OEM Silicone Black Epoxy Potting Compound Resin Glue 5:1 For Electrical

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