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Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Name: Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-5508
Availability: InStock

Detail Produk:

Tempat asal:	Guangdong, Cina
Nama merek:	Hanast
Sertifikasi:	ROHS
Nomor model:	HN-5508

Informasi Rinci

Tempat asal:

Guangdong, Cina

Nama merek:

Hanast

Sertifikasi:

ROHS

Nomor model:

HN-5508

Nama:

epoksi pot hitam

Rasio pencampuran:

A: B = 5: 1

Konduktivitas termal:

0,2 W/mK

Warna:

Transparan, Hitam

Aplikasi:

PCB/Baterai/LED

Disesuaikan:

Mendukung

Kekerasan:

Pantai D 80

Fitur:

isolasi tahan api, ikatan penyegelan, tahan kelembaban

Waktu curing:

25 ℃ / 6-8H Surface Stem, 12-16h sepenuhnya sembuh atau 60-80 ℃ / 1.5-2h

suhu distorsi ℃:

130-150

Menyoroti:

High Light

Menyoroti:

Thermal Conductive Potting Adhesive

Insulating Circuit Board Potting Adhesive

Informasi Perdagangan

Kuantitas min Order:

1kg

Harga:

USD

Kemasan rincian:

25kg/barel

Waktu pengiriman:

5-8 hari

Syarat-syarat pembayaran:

D/a, d/p, t/t

Deskripsi Produk

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer Product description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof,

Tag:

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

High Light

Menyoroti:

Thermal Conductive Potting Adhesive

Insulating Circuit Board Potting Adhesive

bahan epoxy potting,

silikon cair bulk,

senyawa potting resin epoksi

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