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Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Detail Produk:
Tempat asal: Guangdong, Cina
Nama merek: Hanast
Sertifikasi: ROHS
Nomor model: HN-5508
Informasi Rinci
Tempat asal:
Guangdong, Cina
Nama merek:
Hanast
Sertifikasi:
ROHS
Nomor model:
HN-5508
Nama:
epoksi pot hitam
Rasio pencampuran:
A: B = 5: 1
Konduktivitas termal:
0,2 W/mK
Warna:
Transparan, Hitam
Aplikasi:
PCB/Baterai/LED
Disesuaikan:
Mendukung
Kekerasan:
Pantai D 80
Fitur:
isolasi tahan api, ikatan penyegelan, tahan kelembaban
Waktu curing:
25 ℃ / 6-8H Surface Stem, 12-16h sepenuhnya sembuh atau 60-80 ℃ / 1.5-2h
suhu distorsi ℃:
130-150
Menyoroti:

High Light

Menyoroti:

Thermal Conductive Potting Adhesive

,

Insulating Circuit Board Potting Adhesive

Informasi Perdagangan
Kuantitas min Order:
1kg
Harga:
USD
Kemasan rincian:
25kg/barel
Waktu pengiriman:
5-8 hari
Syarat-syarat pembayaran:
D/a, d/p, t/t
Deskripsi Produk

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer

Product description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength.

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators, ultrasonic atomizers, and electronics and other components that require insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance, and other main functions.

 

 

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
  A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

 

processabili

 

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

 

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃

-30

 

 

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 0Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 1

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 2

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 3

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 4

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 5

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive 6