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Epoxy Potting Compound

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

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Thermally Conductive Potting Compound

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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

Brand Name:	Hanast
Model Number:	HN-5508AB
MOQ:	1KG
Price:	Negotiable
Packaging Details:	25KG/barrel
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Certification:

ROHS SGS

Name:

Epoxy Resin Potting Adhesive

Type:

Two-component Epoxy Potting Sealant Glue

Feature:

Flame Retardant Insulation, Sealing Bonding, Moisture-proof Earthquake Resistance, Temperature Resistance

Application:

Automobile And Motorcycle Ignition, LED Driver Power Supply, Sensor

Hardness:

85-95 Shore A

Distortion Temperature ℃:

130-150

Highlight:

bulk epoxy resin potting compound

Silicone epoxy resin potting compound

bulk potting epoxy electronics

Product Description

Silicone Manufacturer Flame Retardant Epoxy Potting Glue For Temperature Sensors Controllers Ignition Coils Epoxy Electronic Potting Glue 5:1 Epoxy Potting Compounds

Product Description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness

technical parameter

uring	builder	Epoxy resin 5508	Curing agent 5508
	pigment	Black / White et al	Ruburn / transparent surface
		A sticky epoxy resin water	r liquid specific
	c gravity, g / cm3	1.4-1.5	1.05
	Viscosity of 25℃	4,500—6,000cp s	150—250cp storage
	e Period (25℃)	Six months	x months
processabili	mixing ratio	A: B =5:1 (weight ratio)
	Available for a time of 25℃	2-3H (100g mix)
	curing time	25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing	2 Tensile strength of kg/cm	16-18
	2 Compressive strength of kg/cm	18-22
	Resistance to the voltage of kv/mm	20-22
	Surface resistance ofΩ-cm	14 1.2*10
	Volume resistance ofΩ-cm	15 1.1*10
	contraction percentage%	0.35-0.55
	Water absorption rate was 25℃ * 24H	<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Product Feature :

HN-5508AB has insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics 0

How to use:

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics 1

matters need attention:

1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.

2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.

3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.

4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.

5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.

Tags:

epoxy potting material

bulk liquid silicone

epoxy resin potting compound

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