22 KV/Mm Epoxy Potting Compound Glue Potting For Capacitors, Transformers, Sensors, LED Modules Electronic Potting Silicone Rubber
Product description:
Epoxy resin potting compound is a thermosetting encapsulating material based on epoxy resin. Through mixing with a curing agent, it reacts to form a robust and durable insulator, commonly used for insulation, moisture protection, dustproofing, waterproofing, and fixing of electronic components. It comes in two types: two-component room-temperature curing and one-component high-temperature curing. It possesses excellent insulation properties, chemical resistance, high mechanical strength, and adhesion.
Application:
Main Applications:
Electronic Component Packaging: Providing insulation and physical protection for components such as capacitors, transformers, sensors, and LED modules.
Circuit Board Protection: Used for the confidentiality, insulation, and moisture protection of circuit boards.
Automotive, Aerospace, and Other Fields: Used in electronic products requiring high strength and resistance to harsh environments.
| Before curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30
|
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