2.0 W/m·K Silicone Potting Compound | HN-8820 A/B | RTV Addition Cure
Product Overview for Thermally Conductive Potting Compound:
HN-8820 A/B is a low-viscosity, RTV addition-type silicone potting material with 2.0 W/m·K thermal conductivity. It ensures effective heat management and electrical safety for modern electronic devices.
Key Benefits for Thermally Conductive Potting Compound:
Efficient thermal management
1:1 mix for easy handling
Long pot life for production flexibility
Stable performance across temperatures
Technical Parameters for Thermally Conductive Potting Compound:
Density: 2.36 g/cm³
Cure @ 80°C: 10–20 min
Volume Resistivity: ≥5.0×10¹⁴ Ω·cm
Flame Retardancy: V-0
Applications for Thermally Conductive Potting Compound:
PCB potting
Ignition coils
Power converters
Industrial controls
Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.
FAQ for Thermally Conductive Potting Compound:
•Q: How long does it take to cure at 80°C?
A: 10–20 minutes.
• Q: Is it suitable for automotive use?
A: Absolutely.
• Q: Can it be used on flexible circuits?
A: Yes, it remains elastic.
• Q: What is the pot life?
A: 1–2 hours at 25°C.
• Q: Is it RoHS compliant?
A: Yes, it is.
Your message must be between 20-3,000 characters!
