Two-Part Potting Compound | HN-8820 | Thermal Conductivity 2.0 W/m·K | Easy Cure

Two-Part Potting Compound | HN-8820 | Thermal Conductivity 2.0 W/m·K | Easy Cure

Product Overview for Thermally Conductive Potting Compound:

HN-8820 two-part silicone potting compound delivers 2.0 W/m·K thermal conductivity and robust environmental protection. Its 1:1 ratio and room-temperature cure simplify manufacturing.

Performance Highlights for Thermally Conductive Potting Compound

Easy 1:1 mix by weight or volume

Non-corrosive and safe to use

Stable over a wide temperature range

Good chemical resistance

Technical Parameters for Thermally Conductive Potting Compound:

• Base: Polysiloxane

•Viscosity: 5000–8000 cP

•Resistivity: ≥5.0×10¹⁴ Ω·cm

•Flame Rating: V-0

Applications for Thermally Conductive Potting Compound:

• Motor drives

• Battery management systems

• RF modules

• Consumer electronics

• 

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:

Q: What is the thermal conductivity?
A: 2.0 W/m·K.

Q: Is it suitable for potting coils?
A: Yes, it penetrates well.

Q: Can it be applied manually?
A: Yes, for small batches.

Q: Does it support rework?
A: It can be removed mechanically.

Q: Is it waterproof?
A: Yes, fully.