Product Description
Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio
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HN-8810A/B is a two-component, addition-cure RTV silicone potting compound designed for superior thermal management and environmental protection of electronic assemblies. With a 1:1 mix ratio and low viscosity, it ensures easy processing and reliable performance in demanding applications
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Typical Applications
Automotive electronics: HID ballasts, ignition control modules
Power supplies & inverters
Network transformers & communication devices
LED drivers & lighting systems
PCB potting and encapsulation
Technical Specifications
| Property | Value |
|---|---|
| Mix Ratio (A:B) | 1:1 by weight |
| Viscosity (mixed) | 2000-3000 cP |
| Hardness (Shore A) | 45-50 |
| Thermal Conductivity | 1.0 ± 0.1 W/m·K |
| Volume Resistivity | ≥5.0×10¹⁴ Ω·cm |
| Flame Retardancy | UL94 V-0 |
| Curing Time (25°C) | 2-4 hours |
| Curing Time (80°C) | 10-20 minutes |
How to Use HN-8810 Potting Compound
Weighing – Accurately weigh components A and B in a 1:1 ratio.
Mixing – Stir thoroughly until uniform color is achieved.
Degassing – Vacuum degas to remove entrapped air bubbles.
Potting – Pour into clean, dry housing; avoid contamination.
Curing – Allow to cure at room temperature or accelerate with mild heat.
Compatibility Notes
Avoid contact with inhibitors such as:
Organotin compounds
Sulfur or amine-based materials
Phosphorous-containing substances
Acidic residues or flux
Packaging & Storage
50 kg/kit (25 kg A + 25 kg B)
Store in a cool, dry place away from direct sunlight
Shelf life: 6 months in sealed containers