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Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio

Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio

Product Details:
Place of Origin: Shenzhen in China
Brand Name: Hanast
Certification: FDA
Model Number: HN-8810A/B
Detail Information
Place of Origin:
Shenzhen in China
Brand Name:
Hanast
Certification:
FDA
Model Number:
HN-8810A/B
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HN-8810 thermal conductive silicone potting

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1:1 mix ratio RTV-2 silicone

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factory direct silicone potting compound

Trading Information
Minimum Order Quantity:
2 kgs/ for sample
Price:
6.5$
Packaging Details:
2kg, 10kg, 25kg
Delivery Time:
5-8 work days
Payment Terms:
T/T,Paypal
Supply Ability:
20 tons/day
Product Description

Product Description

  1. Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio

Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio 0

  • Product Overview

    HN-8810A/B is a two-component, addition-cure RTV silicone potting compound designed for superior thermal management and environmental protection of electronic assemblies. With a 1:1 mix ratio and low viscosity, it ensures easy processing and reliable performance in demanding applications



    Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio 1

    Factory Direct HN-8810 Thermal Conductive 1.0 Silicone Potting Compound RTV-2 1:1 Mix Ratio 2

    Key Features & Benefits

    Excellent Thermal Conductivity – 1.0 W/m·K effectively dissipates heat, prolonging component life.
    Wide Operating Temperature Range – Stable performance from -40°C to 150°C.
    High Insulation & Flame Retardancy – Volume resistivity ≥5.0×10¹⁴ Ω·cm, UL94 V-0 rated.
    Waterproof & Anti-Aging – Protects against moisture, humidity, and long-term degradation.
    Easy to Use – 60-120 minutes work time at 25°C, cures fully in 2-4 hours at room temperature.


    Typical Applications

    Automotive electronics: HID ballasts, ignition control modules

    Power supplies & inverters

    Network transformers & communication devices

    LED drivers & lighting systems

    PCB potting and encapsulation


    Technical Specifications



    Property Value
    Mix Ratio (A:B) 1:1 by weight
    Viscosity (mixed) 2000-3000 cP
    Hardness (Shore A) 45-50
    Thermal Conductivity 1.0 ± 0.1 W/m·K
    Volume Resistivity ≥5.0×10¹⁴ Ω·cm
    Flame Retardancy UL94 V-0
    Curing Time (25°C) 2-4 hours
    Curing Time (80°C) 10-20 minutes


    How to Use HN-8810 Potting Compound

    1. Weighing – Accurately weigh components A and B in a 1:1 ratio.

    2. Mixing – Stir thoroughly until uniform color is achieved.

    3. Degassing – Vacuum degas to remove entrapped air bubbles.

    4. Potting – Pour into clean, dry housing; avoid contamination.

    5. Curing – Allow to cure at room temperature or accelerate with mild heat.

    Compatibility Notes
    Avoid contact with inhibitors such as:

    • Organotin compounds

    • Sulfur or amine-based materials

    • Phosphorous-containing substances

    • Acidic residues or flux

    Packaging & Storage

    • 50 kg/kit (25 kg A + 25 kg B)

    • Store in a cool, dry place away from direct sunlight

    • Shelf life: 6 months in sealed containers