Clear Epoxy Potting Compound with 2:1 Mix Ratio and 70 Shore D Hardness for Solar Inverter Encapsulation

Clear Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70 Shore D for Solar Inverter Encapsulation

HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for solar inverter, photovoltaic junction box and power electronics encapsulation. The self-leveling low-viscosity system flows easily around PCB components and cures into a transparent, hard, bubble-free protective layer with outstanding electrical insulation, UV-resistant clarity and long-term outdoor reliability.

Key Features

• High transparency: clear cured body enables visual inspection of components and wire bonds after potting.
• Excellent insulation: protects solar inverter PCBs and junction boxes from high voltage breakdown, arcing and leakage current.
• 2:1 two-component system: simple mix ratio, low viscosity and self-leveling flow compatible with automatic dispensing lines.
• 70 Shore D hardness: rigid cured body protects components against vibration, shock and thermal expansion stress.
• Wide temperature range: stable performance from -40℃ to 120℃ for outdoor photovoltaic environments.
• Moisture & weathering resistance: seals junction boxes against humidity, salt spray and UV aging.
• ROHS & SGS compliant: meets environmental requirements for photovoltaic and electronics industries.

Technical Parameters

Applications

Solar inverter junction boxes, photovoltaic module connectors, LED modules, lighting fixtures, transformers, high-voltage components and other electronic devices requiring clear high-insulation encapsulation.

Customization and OEM/ODM supported. Contact us for free samples.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone and epoxy materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electronics, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation. Headquartered in Shenzhen, Guangdong, China, we offer free samples, custom formulation and wholesale bulk supply at factory-direct pricing.

FAQ

Q1: What is HN-5506A/B and what is it designed for?
A1: HN-5506A/B is a two-component, high-transparency epoxy crystal glue (Epoxy Potting Compound) with high hardness, low viscosity, excellent self-levelling and defoaming. It cures to a crystal-clear, UV-resistant and anti-yellowing body, ideal for narrow-gap encapsulation of electronic components, LED lighting, display modules, river tabletops and crystal craft.

Q2: What is the mix ratio, pot life and curing schedule?
A2: Mix Component A and Component B at a 3:1 ratio by weight. Pot life is 20-30 minutes at 25°C (150 g mix). Initial cure is 6-8 hours and full cure 12-16 hours at 25°C, or a heat-accelerated cure in 1 hour at 80°C (room-temperature pre-cure recommended). One-time pouring of up to 3-5 cm thickness at 25°C is supported with built-in defoaming.

Q3: What are the cured mechanical, electrical and thermal properties?
A3: Cured hardness is Shore D 78-83; dielectric strength is 25 kV/mm; volume resistivity is 4.3 x 10¹⁵ ohm.cm and surface resistivity 2.6 x 10¹⁴ ohm; the glass transition temperature (Tg) is above 90°C and temperature resistance is -60°C to 135°C, with excellent adhesion and low cure shrinkage.

Q4: How should it be mixed, degassed and poured?
A4: Stir Component A thoroughly before use (warm to 60-80°C if crystallised), weigh A and B at 3:1 by weight, mix thoroughly scraping the container walls and bottom, optionally vacuum-degas for high clarity, then pour into the clean, dry mould or device within the pot life. Do not move or stress the part during cure.

Q5: What are the packaging, storage and shelf life, and do you offer customization?
A5: Supplied as Component A 15 kg plastic drum plus Component B 5 kg plastic drum (custom kits available). Store sealed at 5-25°C away from sunlight and moisture; shelf life is 12 months. Classified as non-dangerous goods for transport. Custom OEM/ODM formulation is supported - contact us for free samples.