Fast Curing Adhesive Silicone Potting Compound 10:1 Black for Automotive Electronic Modules

Fast Curing Adhesive Silicone Potting Compound 10:1 Black for Automotive Electronic Modules

This two-component silicone potting compound uses a convenient 10:1 mix ratio and cures at room temperature into a soft, flexible black rubber (30-40 Shore A). Its fast curing system can be accelerated further by increasing Part B, while still offering a 40-60 minute operating time for easy handling. The low-viscosity black liquid delivers strong adhesion to aluminum substrates, excellent electrical insulation and reliable waterproof sealing, making it ideal for potting circuit boards, LED power supplies, waterproof power supplies and automotive electronic modules.

Key Features

• Fast Curing — cures in 4-6 hours at 25°C and can be sped up by raising the Part B ratio
• Soft & Flexible 30-40 Shore A — low-stress elastic cushioning protects delicate components and solder joints
• Strong Adhesion — excellent bonding to aluminum substrates and most electronic components, no primer required
• Low Viscosity Black Liquid — flows into narrow gaps and complex cavities for void-free potting
• Electrical Insulation — dielectric strength 14 kV/mm, dielectric constant 3.5, volume resistivity 5.0x10¹⁴ ohm.cm
• Waterproof Protection — seals against moisture and water for outdoor and automotive electronics
• Custom Formula — mix ratio and properties can be tuned to meet specific application requirements
• 10:1 Mix Ratio — forgiving dosing with wide process tolerance

Applications

• Automotive electronic modules and control units
• LED driver and power supply potting
• Circuit board and waterproof power supply sealing
• Components requiring adhesion to aluminum substrates

Supplied as Part A (black liquid) and Part B (transparent liquid) in 11 KG and 22 KG sets with 6-month shelf life. Contact us for samples, custom formulation and OEM/ODM bulk pricing.