10:1 Mix Ratio Flame Retardant High Dielectric Strength Silicone Potting Compound for Power Module

HANAST HN-8808 A/B Transparent Silicone Potting Compound

HN-8808 A/B is a two-component condensation-cure (RTV-2) liquid silicone potting compound supplied in a 10:1 ratio. After mixing Component A and Component B at 10:1 by weight, the compound cures at room temperature into a transparent, high-performance elastomer for potting and encapsulation of power modules, PCBs and electronic assemblies. The cured material features good adhesion, no corrosion, small chemical shrinkage, no exotherm during cure and excellent electrical insulation over a wide operating temperature range.

Key Features

• 10:1 mix ratio by weight with room-temperature curing for easy operation
• Transparent cured elastomer for visual inspection of potted components
• High dielectric strength of 14 kV/mm or more with dielectric constant of 3.0 or less
• Wide operating temperature range from -50°C to 200°C
• Good adhesion to aluminium, iron, acrylic and PC substrates with primerless bonding
• Non-corrosive, no exotherm and small chemical shrinkage protect delicate electronic parts
• Waterproof and moisture proof, protecting electronic assemblies from humidity
• Flame retardant formulation engineered for power module and power supply safety
• Non-toxic and non-hazardous, supplied as a general chemical; RoHS and REACH compliant with SDS available
• Deep-section through cure, full cure in 8-24 hours at 25°C
• 6 months shelf life with stable storage and easy shipping

Typical Applications

• Potting protection of circuit boards (PCBs) and LED power supplies
• Power modules, AC-DC converters, DC-DC modules, motor drives and inverter boards
• Waterproof power supplies and automotive electronic modules (ECU, sensors, actuators)
• Electrical appliances, light sources, lamps and their accessories
• Aluminium substrate potting requiring strong adhesion
• Solar photovoltaic junction boxes and industrial sensor sealing
• General electronic encapsulation requiring transparent, waterproof and insulating protection

Technical Data (per TDS HANAST-TDS-027)

OEM / ODM Customization & Bulk Supply

As a direct silicone potting compound manufacturer, Hanast supports OEM and ODM customization of hardness, viscosity, curing time and flame retardancy, and provides an SDS on request. Wholesale and factory-direct pricing, bulk iron-drum packaging and private-label supply are available for high-volume production lines.

Packaging & Storage

Supplied as Component A (20kg or 10kg iron/plastic drum) together with Component B (2kg or 1kg plastic bottle), or as ready 10:1 kits of 22kg/set or 11kg/set. Keep components sealed in a cool, dry, ventilated place below 25°C, protected from direct sunlight and moisture. Shelf life is 6 months; best used within 3 months. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8808 A/B and which applications does it suit?
A1: HN-8808 A/B is a 10:1 two-component condensation-cure liquid silicone potting compound. It suits potting of power modules, PCBs, LED power supplies, waterproof power supplies, automotive electronic modules (ECU) and general electronic encapsulation.

Q2: What is the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 10:1 ratio by weight. The compound cures at room temperature, with full cure in 8-24 hours at 25°C. After initial cure, gentle heating not exceeding 60°C may be used to accelerate curing.

Q3: Is it flame retardant and what is the dielectric strength?
A3: HN-8808 is a flame retardant formulation for power module and power supply safety. Its dielectric strength is 14 kV/mm or more with a dielectric constant of 3.0 or less, providing reliable insulation for high-voltage electronics.

Q4: Does it need a primer for good adhesion?
A4: No. HN-8808 offers primerless adhesion to aluminium and many other substrates including iron, acrylic and PC plastics, with non-corrosive curing that does not attack metal parts.

Q5: What certifications, MOQ and packaging are available?
A5: HN-8808 is RoHS and REACH compliant with an SDS available, and is classified as non-dangerous goods. It is supplied in 22kg/set or 11kg/set 10:1 kits, with wholesale and OEM/ODM bulk supply supported.