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Shenzhen Potting Compound Factory 1:1 Low Viscosity RTV Silicone Potting Compound for IGBT Power Module

Shenzhen Potting Compound Factory 1:1 Low Viscosity RTV Silicone Potting Compound for IGBT Power Module

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: HANAST
Certification: RoHS, REACH, UL94 V-0, SDS available
Model Number: HN-8806 A/B
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
HANAST
Certification:
RoHS, REACH, UL94 V-0, SDS available
Model Number:
HN-8806 A/B
Model:
HN-8806 A/B
Type:
Two Component Addition Cure (RTV) Thermal Conductive Silicone Potting Compound
Mix Ratio:
1:1 By Weight
Pot Life:
18-24 Minutes At 25 C
Cure Schedule:
Room Temperature 2-3 Hours (preliminary); 80 C Accelerated 12 Minutes
Appearance (Before Mixing):
Component A White Liquid / Component B Grey Liquid
Appearance (Cured):
Grey Elastomer
Viscosity:
2000-3000 MPa.s At 25 C
Density:
1.60 +/- 0.05 G/cm3
Hardness:
Shore A 45 +/- 5
Thermal Conductivity:
>=0.76 W/m.K
Volume Resistivity:
1.0 X 10^16 Ohm.cm
Dielectric Strength:
25-30 KV/mm
Flame Retardancy:
UL94 V-0
Operating Temperature:
-50 C To 250 C
Factory Location:
Shenzhen, Guangdong, China
Application:
IGBT Power Module, EV Charging Pile, Battery Pack, High-voltage Transformer
Compliance:
RoHS, REACH; SDS Available
Safety Classification:
Non-hazardous (general Chemical)
Packaging:
50kg/set (25kg A + 25kg B)
Shelf Life:
6 Months
Highlight:

High Light

Highlight:

1:1 Low Viscosity RTV Potting Compound

,

IGBT Power Module Encapsulant

,

EV Charging Pile Silicone Potting Gel

Trading Information
Minimum Order Quantity:
1 kg
Packaging Details:
50kg/set (25kg barrel A + 25kg barrel B), sealed containers, shipped by air or sea
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Payment Terms:
T/T,L/C,Western Union,PayPal
Supply Ability:
120 Tons per Month
Product Description

HANAST HN-8806 A/B 1:1 Low Viscosity RTV Silicone Potting Compound for IGBT Power Module

HN-8806 A/B is a two-component 1:1 RTV silicone potting compound developed for IGBT power module encapsulation and EV charging pile electronics protection. Produced by our Shenzhen potting compound factory in Guangdong, China, it flows readily for complete under-fill around IGBT modules and dense power assemblies, then cures at room temperature or by heating into a high-performance grey elastomer that combines thermal conductivity, UL94 V-0 flame retardancy and reliable high-voltage insulation.

Key Features

  • Low viscosity for complete penetration and under-fill around IGBT modules and dense SMD assemblies
  • Thermal conductivity of 0.76 W/m·K or more for heat dissipation in power modules
  • High dielectric strength of 25-30 kV/mm for high-voltage power electronics
  • UL94 V-0 flame retardancy and RoHS compliance for public charging infrastructure safety
  • Wide operating temperature range from -50°C to 250°C
  • 1:1 mix ratio by weight with room temperature or heat-accelerated curing
  • Deep-section curing with extremely low cure shrinkage and no stress on IGBT wire bonds
  • No heat or by-products released during cure; non-corrosive to sealed components
  • Short 18-24 minute pot life at 25°C for efficient production
  • RoHS and REACH compliant, supplied as non-dangerous goods with SDS available

Typical Applications

  • IGBT power modules in inverters, motor drives and power converters
  • EV charging pile and fast-charging station power modules
  • Battery pack BMS boards, fast-charging adapters and high-voltage transformers
  • Power modules and circuit boards with heat dissipation requirements
  • Sensors, controllers and general electronic appliances requiring insulation and moisture resistance
  • Applications requiring deep-section curing and low shrinkage

Technical Data (per TDS HANAST-TDS-004)

PropertyValue
ModelHN-8806 A/B
Cure TypeTwo-component addition cure (RTV), room temperature or heat accelerated
Mix Ratio (A:B)1:1 by weight
Appearance (Before Mixing)Component A white liquid / Component B grey liquid
Appearance (Cured)Grey elastomer
Viscosity (25°C)2000-3000 mPa·s
Density (25°C)1.60 ±0.05 g/cm³
Pot Life / Operating Time (25°C)18-24 minutes
Cure Time (25°C)2-3 hours (preliminary)
Cure Time (80°C)12 minutes (heat accelerated)
HardnessShore A 45 ±5
Thermal Conductivity≥0.76 W/m·K
Volume Resistivity1.0×10¹&sup6; Ω·cm
Dielectric Strength25-30 kV/mm
Flame RetardancyUL94 V-0
Operating Temperature-50°C to 250°C
Shelf Life6 months
Packaging50kg/set (25kg A + 25kg B)

Shenzhen Potting Compound Factory & OEM Supply

Hanast is a direct Shenzhen potting compound factory based in Guangdong, China, with a 40,000 m² production facility. As a Guangdong potting compound factory and China potting compound factory supplier, we support OEM and ODM customization of viscosity, hardness, thermal conductivity and cure speed, and provide an SDS on request. Wholesale factory-direct pricing and multi-ton batch consistency are available for IGBT and EV charging projects.

Packaging & Storage

Supplied as Component A (25kg plastic barrel) and Component B (25kg plastic barrel), or as a ready 50kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

FAQ

Q1: What is HN-8806 A/B and which applications does it suit?
A1: HN-8806 A/B is a 1:1 low viscosity RTV silicone potting compound. It is designed for IGBT power modules, EV charging pile power modules, battery pack BMS boards and high-voltage transformers requiring insulation, heat dissipation and moisture protection.

Q2: Is the viscosity low enough for IGBT under-fill and dense PCBs?
A2: Yes. Its low viscosity allows complete penetration and under-fill around IGBT modules, transformers and dense SMD assemblies without trapped air pockets.

Q3: What is the mix ratio and curing schedule?
A3: Mix Component A and Component B at a 1:1 ratio by weight, with an 18-24 minute pot life at 25°C. It cures at room temperature in 2-3 hours (preliminary) or in 12 minutes at 80°C for fast cure.

Q4: What is the dielectric strength, thermal conductivity and temperature range?
A4: Dielectric strength is 25-30 kV/mm, thermal conductivity is 0.76 W/m·K or more, and the operating temperature range is -50°C to 250°C, with UL94 V-0 flame retardancy.

Q5: Where is it manufactured and what certifications, MOQ and packaging are available?
A5: It is manufactured in our Shenzhen potting compound factory in Guangdong, China. HN-8806 A/B is RoHS and REACH compliant with an SDS available and is classified as non-dangerous goods, supplied in 50kg/set (25kg A + 25kg B) kits with OEM/ODM bulk supply supported.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

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100%
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All Reviews

I
I*y
India Aug 6.2026
Our technical department speaks highly of this silicone gel for electronics,very suitable for our flow maters; we have collaborated three times already and will continue to work together in the future.