10:1 Mix Ratio Transparent Waterproof Condensation-Cure RTV-2 Silicone Potting Compound for PCB LED Encapsulation

HANAST HN-8808A/B 10:1 Clear RTV Transparent Silicone Potting Compound for PCB and LED Encapsulation

HN-8808A/B is a two-part clear RTV silicone potting compound (condensation-cure, tin RTV-2 liquid silicone rubber). Mixed at a 10:1 ratio by weight, Components A and B cure at room temperature into a high-performance transparent soft elastomer with good adhesion, no corrosion, small chemical shrinkage and no exotherm. Its optically clear, water-clear appearance allows visual inspection of potted components, while its waterproof, moisture-proof and electrical insulation properties protect PCBs, LED power supplies and automotive electronic modules across a wide −50 °C to 200 °C range.

Key Features

• Clear / transparent encapsulant — cured to a water-clear, see-through elastomer (optical clear) for visual inspection of potted components.
• Two-part 10:1 RTV silicone system — easy room-temperature condensation cure; simple A/B ratio by weight.
• Waterproof & moisture-proof — water resistant, humidity protection and damp proof sealing (waterproofing compound) for electronic assemblies.
• Excellent electrical insulation — insulation resistance and electrical insulating potting with dielectric strength ≥ 14 kV/mm and dielectric constant ≤ 3.0 (insulation compound).
• Good adhesion — strong adhesion to various substrates, especially aluminium; adhesive strength for metal and PCBs (substrate adhesion).
• Soft & elastic — flexible, low-stress potting that cushions components (impact resistance, mechanical protection, vibration dampening).
• Wide operating temperature −50 °C to 200 °C — a heat resistant silicone encapsulant with excellent thermal stability.
• Non-corrosive & low stress — small chemical shrinkage, no exotherm during cure and no corrosion to potted components.
• Non-toxic, odourless and RoHS/SGS compliant — non-dangerous, general chemical for global shipment.

Technical Specifications (HN-8808A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly to disperse any settled filler; shake or stir Component B (curing agent) well.
2. Weighing: Accurately weigh Components A and B at a 10:1 ratio by mass using a precision scale. Store A and B separately; keep the work area clean and dry.
3. Mixing: Mix A and B thoroughly by hand or machine until uniform in colour; scrape the container walls and bottom. Avoid preparing too large a batch at once, as fluidity may decrease. Curing is faster in summer and slower in winter.
4. Degassing: Vacuum degas the mixed compound to remove entrapped air for void-free potting. Do not completely seal the potted device or heat above 100 °C before the cure mass is fully released.
5. Potting: Pour the degassed compound into the clean, dry device to complete potting; ensure complete coverage of the components.
6. Curing: Cure at room temperature; initial cure allows the next process, with complete cure in 8–24 h. After initial cure, gentle heating (not exceeding 60 °C) may be used to accelerate curing. If complete sealing is required, wait 3 days (summer) or 7 days (winter).

Typical Applications

Clear RTV potting, sealing and encapsulation of electronics requiring transparent, waterproof and insulating protection, including:

• Circuit boards (PCBs), LED modules, LED drivers and LED power supply potting (LED encapsulant / lighting potting)
• Waterproof power supplies and waterproof electronic assemblies
• Automotive electronic modules, automotive ECU and sensors
• Power modules, transformers, connectors and junction boxes
• Electrical appliances, light sources, lamps and their accessories
• Aluminium substrates and metal housings requiring good adhesion (substrate adhesion)
• General electronic encapsulation requiring transparent, waterproof and insulating protection (outdoor and humid environments)

Packaging, Storage & Supply

• Packaging: Component A 20 kg / 10 kg iron or plastic drum; Component B 2 kg / 1 kg plastic bottle; kit 22 kg/set (20+2) or 11 kg/set (10+1).
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area below 25 °C; protect from direct sunlight, moisture and extreme temperatures. Reseal immediately after opening.
• Shelf life: 6 months from date of manufacture when stored unopened; best used within 3 months.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization, free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8808A/B and which applications does it suit?

HN-8808A/B is a 10:1 two-part transparent condensation-cure (tin) RTV-2 silicone potting compound that cures at room temperature into a clear, soft elastomer. It suits clear potting and protection of PCBs, LED modules and drivers, LED power supplies, automotive electronic modules, power modules and aluminium substrates.

Q2: What are the mix ratio and curing schedule?

Mix Component A and Component B at a 10:1 ratio by weight. It cures at room temperature; initial cure allows the next process and complete cure takes 8–24 hours at 25 °C. After initial cure, gentle heating not exceeding 60 °C may be used to accelerate curing.

Q3: What are the electrical insulation and thermal performance?

It offers excellent electrical insulation with dielectric strength ≥ 14 kV/mm and dielectric constant ≤ 3.0, and operates over a wide −50 °C to 200 °C range with good thermal stability.

Q4: Is it transparent, waterproof and low stress?

Yes. It cures to a transparent, water-clear elastomer for visual inspection, is waterproof and moisture-proof with humidity protection, and cures with small chemical shrinkage, no exotherm and no corrosion, providing low-stress protection with good adhesion, especially to aluminium.

Q5: What are the MOQ, packaging and delivery time?

Minimum order quantity is 1 kg, supplied as 22 kg/set (A 20 kg + B 2 kg) or 11 kg/set (A 10 kg + B 1 kg) kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days, with bulk silicone encapsulant supply available across Asia and worldwide.