10:1 Mix Ratio AB Soft Reworkable Silicone Potting Compound with Good Adhesion for Electronic Encapsulation

HANAST HN-8808A/B 10:1 AB Soft Reworkable Silicone Potting Compound for Electronic Appliance Encapsulation

HN-8808A/B is a two-component AB silicone potting compound (condensation-cure, tin RTV-2 liquid silicone rubber). Mixed at a 10:1 ratio by weight, Components A and B cure at room temperature into a high-performance soft, elastic, reworkable elastomer with good adhesion and no corrosion, small chemical shrinkage and no exotherm. Its transparent, waterproof and electrical insulating properties make it an ideal silicone rubber raw material for potting, sealing and encapsulating electronic appliances, circuit boards and LED power supplies across a wide −50 °C to 200 °C range.

Key Features

• AB two-component 10:1 system — easy room-temperature condensation cure; simple A/B ratio by weight (silicone rubber raw material).
• Soft, elastic and reworkable — soft potting / repairable potting / flexible encapsulant for stress-free protection and easy rework of potted assemblies.
• Good adhesion, no corrosion — strong adhesive strength (substrate adhesion / adhesion to PCB and aluminium) with a non-corrosive, non-swelling formulation.
• Transparent encapsulant — clear, water-clear (optical clear) cured elastomer for visual inspection of potted components.
• Waterproof and moisture-proof — water resistant, humidity protection and damp proof sealing (waterproofing compound) for electronic appliances.
• Excellent electrical insulation — insulation resistance and electrical insulating potting with dielectric strength ≥ 14 kV/mm and dielectric constant ≤ 3.0 (insulation compound).
• Wide operating temperature −50 °C to 200 °C — a heat resistant silicone encapsulant with excellent thermal stability.
• Small chemical shrinkage, no exotherm — low-stress cure with no heat release and no by-products.
• Non-toxic, odourless and RoHS/SGS compliant — non-dangerous, general chemical for global shipment.

Technical Specifications (HN-8808A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly to disperse any settled filler; shake or stir Component B (curing agent) well.
2. Weighing: Accurately weigh Components A and B at a 10:1 ratio by mass using a precision scale; store A and B separately in a clean, dry area.
3. Mixing: Mix A and B thoroughly by hand or machine until uniform in colour; scrape the container walls and bottom. Avoid preparing too large a batch at once. Curing is faster in summer and slower in winter.
4. Degassing: Vacuum degas the mixed compound to remove entrapped air for void-free potting. Do not completely seal the potted device or heat above 100 °C before the cure mass is fully released.
5. Potting: Pour the degassed compound into the clean, dry device within the working time / open time to complete potting; ensure complete coverage.
6. Curing: Cure at room temperature; initial cure allows the next process, with complete cure in 8–24 h. After initial cure, gentle heating (not exceeding 60 °C) may be used to accelerate curing. If complete sealing is required, wait 3 days (summer) or 7 days (winter).

Typical Applications

Soft, transparent, waterproof potting and encapsulation of electronics and electronic appliances, including:

• Electronic components, electronic appliances and electrical modules
• Circuit boards (PCBs), backlight units and LED power supplies
• Waterproof power supplies and waterproof electronic assemblies
• Solar energy, solar module, PV junction box and photovoltaic encapsulant
• 5G base station, RF module, antenna potting and telecom equipment
• Automotive electronic modules, automotive ECU and sensors
• Power modules, transformers, connectors and junction boxes
• Aluminium substrates and metal housings requiring good adhesion (substrate adhesion)

Packaging, Storage & Supply

• Packaging: Component A 20 kg / 10 kg drum; Component B 2 kg / 1 kg plastic bottle; kit 22 kg/set (20+2) or 11 kg/set (10+1).
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area below 25 °C; protect from direct sunlight, moisture and extreme temperatures. Reseal immediately after opening.
• Shelf life: 6 months from date of manufacture when stored unopened; best used within 3 months.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of colour, hardness and viscosity, free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8808A/B and which applications does it suit?

HN-8808A/B is a 10:1 AB two-part transparent condensation-cure (tin) RTV-2 silicone potting compound that cures at room temperature into a soft, reworkable elastomer. It suits potting and encapsulation of electronic appliances, electronic components, circuit boards, LED power supplies, backlight, electrical modules and solar modules.

Q2: What are the mix ratio and curing schedule?

Mix Component A and Component B at a 10:1 ratio by weight. It cures at room temperature; initial cure allows the next process and complete cure takes 8–24 hours at 25 °C. After initial cure, gentle heating not exceeding 60 °C may be used to accelerate curing.

Q3: Does it have good adhesion and is it non-corrosive?

Yes. It provides good adhesion to various substrates, especially aluminium, with strong substrate adhesion, and it is non-corrosive and non-swelling with small chemical shrinkage and no exotherm during cure.

Q4: Is it soft, transparent and waterproof with good insulation?

Yes. It cures to a soft, transparent, water-clear soft elastomer for stress-free, reworkable protection, is waterproof and moisture-proof with humidity protection, and offers excellent electrical insulation (dielectric strength ≥ 14 kV/mm, dielectric constant ≤ 3.0) over −50 °C to 200 °C.

Q5: What are the MOQ, packaging and delivery time?

Minimum order quantity is 1 kg, supplied as 22 kg/set (A 20 kg + B 2 kg) or 11 kg/set (A 10 kg + B 1 kg) kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days, with bulk silicone encapsulant supply available across Asia and worldwide.