Thermal Conductive Flame Retardant Silicone Potting Compound with UL 94 V-0 and Fast Cure for Electronics

HANAST HN-8806A/B 1:1 Thermal Conductive Flame Retardant Silicone Potting Compound for Electronic Components

HN-8806A/B is a two-component thermal conductive silicone potting compound that cures at room temperature or by heating into a high-performance elastomer. Mixed at a 1:1 ratio by weight, it combines UL 94 V-0 flame retardancy with thermal conductivity (≥ 0.76 W/m·K), high electrical insulation and fast heat-accelerated cure. With a wide −50 °C to 250 °C operating range and extremely low cure shrinkage, it is an ideal heat conductive potting adhesive for potting and protecting electronic components and power modules requiring both heat dissipation and fire safety.

Key Features

• Thermal conductive potting — thermal conductivity ≥ 0.76 W/m·K for effective heat transfer, heat dissipation and thermal management (thermal interface / thermal potting compound).
• Flame retardant & fire resistant — UL 94 V-0 flame retardant compound; self-extinguishing, non-flammable and fire retardant silicone for consumer and industrial electronics.
• Fast cure — quick cure at 80 °C in only 12 minutes (rapid curing / short curing time), or room-temperature cure in 2–3 h preliminary, for high-throughput production.
• Wide operating temperature −50 °C to 250 °C — heat resistant silicone with excellent ageing resistance and thermal stability.
• High electrical insulation — volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm (insulation compound / electrical insulating potting).
• Waterproof and moisture proof — water resistant, humidity protection and damp proof sealing (waterproofing compound).
• UV and weather resistant — UV stable, anti-yellowing outdoor encapsulation for long-term reliability (outdoor UV applications).
• Extremely low cure shrinkage — no heat or by-products released during cure, no corrosion to sealed components, deep-section curing and long-term reliability.
• RoHS compliant, non-hazardous general chemical.

Technical Specifications (HN-8806A/B)

Mixing & Application Instructions

1. Pre-mix: Stir Components A and B thoroughly before use as fillers may settle during storage. Seal containers tightly after use.
2. Weighing: Accurately weigh Components A and B at a 1:1 ratio by weight using a precision electronic scale.
3. Mixing: Mix A and B thoroughly in the same direction to avoid introducing excessive bubbles; scrape the container walls and bottom for full dispersion. Uneven mixing may cause local incomplete cure.
4. Degassing (optional): For void-sensitive applications, vacuum degas to remove air introduced during mixing for void-free potting and deep fill of fine gaps and windings.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within the open time / working time (pot life 18–24 min at 25 °C), ensuring complete coverage; suitable for manual potting and automatic dispensing machines.
6. Curing: Cure at room temperature (25 °C, 2–3 h preliminary) or heat accelerated at 80 °C in only 12 min for fast, rapid curing. Do not move or stress the part during cure.

Typical Applications

Thermal conductive and flame retardant potting of electronics requiring heat dissipation and fire safety, including:

• Electronic components, electronic appliances, sensors and controllers
• Power modules and circuit boards (PCBs) with heat dissipation requirements - EV potting, BMS potting and inverter potting
• LED drivers, LED modules, LED lighting and lighting potting
• Transformers, inductors, IGBT, power supplies and connectors
• Automotive electronics, automotive ECU, on-board charger (OBC) and ignition coils
• 5G base station, 5G potting and RF module encapsulation
• Photovoltaic, solar inverter, junction box potting and renewable energy
• Underwater, outdoor and humid-environment electronic encapsulation (outdoor UV)

Packaging, Storage & Supply

• Packaging: Component A 25 kg + Component B 25 kg, 50 kg/set kit.
• Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area; protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.
• Supply: Direct China manufacturer (Shenzhen, Guangdong) offering OEM/ODM customization of colour, hardness, viscosity and thermal conductivity, free samples and bulk wholesale supply at factory-direct pricing.

About This Supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-8806A/B and which applications does it suit?

HN-8806A/B is a 1:1 two-component thermal conductive flame retardant silicone potting compound. It is designed for potting and protection of electronic components, power modules, circuit boards, sensors, controllers, EV/automotive electronics, 5G and photovoltaic modules requiring heat dissipation and fire safety.

Q2: What are the thermal conductivity and flame retardancy?

It offers thermal conductivity ≥ 0.76 W/m·K for heat dissipation and thermal management, with UL 94 V-0 flame retardancy (self-extinguishing, non-flammable) for fire safety, plus volume resistivity 1.0 × 10¹⁶ Ω·cm and dielectric strength 25–30 kV/mm.

Q3: What are the mix ratio and curing schedule?

Mix Component A and Component B at a 1:1 ratio by weight. Pot life is 18–24 min at 25 °C; it cures at room temperature in 2–3 h (preliminary), or in only 12 min at 80 °C for fast, heat-accelerated cure.

Q4: What is the operating temperature range and environment resistance?

It operates from −50 °C to 250 °C, is water resistant and moisture proof with humidity protection, and is UV and weather resistant for harsh, humid and outdoor environments.

Q5: What are the MOQ, packaging and delivery time?

Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits. Free samples ship in 3–5 working days and bulk orders in 7–15 days, with bulk silicone encapsulant supply available across Asia and worldwide.