HANAST HN-8806A/B 1:1 Flexible Electronic Potting Silicone Rubber Sealant for Power Module and Battery Pack
HN-8806A/B is a two-component flexible electronic potting silicone rubber sealant (ODM/OEM silicone raw material) that cures at room temperature or by heating into a high-performance elastomer. Mixed at a 1:1 ratio by weight, it flows as a low-viscosity potting compound that cures in deep sections with low shrinkage, no heat release and no by-products. Its thermal conductivity, aging resistance, moisture-proof and electrical insulation properties, over a wide −50 °C to 250 °C range, make it an ideal flexible potting sealant for power modules, battery packs and fast-charging adapters.

Key Features
- Flexible silicone sealant — soft, elastic and flexible potting that cushions components (impact resistance, mechanical protection, vibration dampening).
- Electronic potting silicone rubber raw material — 1:1 two-component system for easy room-temperature or heat-accelerated cure.
- ODM / OEM customization — colour (white, grey, black), hardness, viscosity, thermal conductivity and curing speed can be customized to your application.
- Thermal conductive potting / sealant — thermal conductivity ≥ 0.76 W/m·K effectively transfers and dissipates heat from electronics (heat transfer, thermal management).
- Aging resistance and moisture-proof — water resistant, humidity protection and damp proof sealing (waterproofing compound) with excellent ageing resistance.
- Deep-section cure & low shrinkage — low-viscosity compound cures in deep sections (deep fill / fine fill) with extremely low cure shrinkage and no by-products.
- Flame retardant — UL 94 V-0 flame retardancy (fire resistant, non-flammable flame retardant compound) for fire safety.
- High electrical insulation — volume resistivity 1.0 × 1016 Ω·cm and dielectric strength 25–30 kV/mm (insulation compound / electrical insulating potting).
- Wide operating temperature −50 °C to 250 °C, no corrosion to sealed components and no environmental pollution; RoHS compliant.

Technical Specifications (HN-8806A/B)
| Property |
Unit |
Value |
| Category |
— |
Silicone Potting Compound (flexible sealant, thermally conductive) |
| Mix Ratio (A : B) |
by weight |
1 : 1 |
| Appearance (A / B, uncured) |
— |
White liquid / Grey liquid |
| Viscosity (25 °C) |
mPa·s |
2000–3000 |
| Density (25 °C) |
g/cm³ |
1.60 ± 0.05 |
| Pot Life / Operating Time (25 °C) |
min |
18–24 |
| Cure Time, Room Temperature (25 °C) |
h |
2–3 (preliminary) |
| Cure Time, Heat Accelerated (80 °C) |
min |
12 (fast cure) |
| Cured Appearance |
— |
Grey elastomer |
| Hardness |
Shore A |
45 ± 5 |
| Thermal Conductivity |
W/m·K |
≥ 0.76 |
| Coefficient of Thermal Expansion |
µm/(m·°C) |
210 |
| Volume Resistivity |
Ω·cm |
1.0 × 1016 |
| Dielectric Strength (25 °C) |
kV/mm |
25–30 |
| Flame Retardancy |
UL 94 |
V-0 |
| Operating Temperature Range |
°C |
−50 to 250 |
Mixing & Application Instructions
- Pre-mix: Stir Components A and B thoroughly before use as fillers may settle during storage. Seal containers tightly after use.
- Weighing: Accurately weigh Components A and B at a 1:1 ratio by weight using a precision electronic scale.
- Mixing: Mix A and B thoroughly in the same direction to avoid introducing excessive bubbles; scrape the walls and bottom for full dispersion. Uneven mixing may cause local incomplete cure.
- Degassing (optional): For void-sensitive applications, vacuum degas to remove air for void-free potting and deep fill of fine gaps and windings.
- Pouring / Potting / Sealing: Pour the mixed compound into the clean, dry device within the open time / working time (pot life 18–24 min at 25 °C), ensuring complete coverage; suitable for manual potting and automatic dispensing machines.
- Curing: Cure at room temperature (25 °C, 2–3 h preliminary) or heat accelerated at 80 °C in only 12 min for fast, rapid curing. Do not move or stress the part during cure.
Typical Applications
Flexible potting, sealing and encapsulation of electronics requiring heat dissipation and moisture-proof protection, including:
- Power modules, battery packs and fast-charging adapters
- Electronic components, electronic appliances and electrical modules
- Circuit boards (PCBs) and sensors requiring deep-section cure
- EV battery, EV potting, BMS potting, battery management systems and inverters
- LED drivers, LED modules, LED lighting and lighting potting
- Transformers, inductors, IGBT, power supplies and connectors
- Automotive electronics, automotive ECU and on-board charger (OBC)
- 5G base station, 5G potting, RF module and photovoltaic junction box potting

Packaging, Storage & Supply
- Packaging: Component A 25 kg + Component B 25 kg, 50 kg/set kit.
- Storage: Store in original, tightly sealed containers in a cool, dry, well-ventilated area; protect from direct sunlight, moisture and extreme temperatures.
- Shelf life: 6 months from date of manufacture when stored as recommended.
- Supply: Direct China manufacturer (Shenzhen, Guangdong) offering ODM/OEM customization of colour, hardness, viscosity, thermal conductivity and cure speed, with free samples (1–2 kg) and bulk wholesale supply at factory-direct pricing.
About This Supplier
Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.
We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ
Q1: What is HN-8806A/B and which applications does it suit?
HN-8806A/B is a 1:1 two-component flexible electronic potting silicone rubber sealant (silicone raw material) that cures into a high-performance elastomer. It suits potting and sealing of power modules, battery packs, fast-charging adapters, electronic components, EV/BMS, LED drivers and 5G/photovoltaic modules.
Q2: What are the mix ratio and curing schedule?
Mix Component A and Component B at a 1:1 ratio by weight. Pot life is 18–24 min at 25 °C; it cures at room temperature in 2–3 h (preliminary), or in only 12 min at 80 °C for fast, heat-accelerated cure.
Q3: Does it cure in deep sections with low shrinkage?
Yes. It is a low-viscosity potting compound that cures in deep sections (deep fill / fine fill) with extremely low cure shrinkage, no heat release and no by-products, and causes no corrosion to sealed components.
Q4: What are the thermal, flame retardant and insulation performance?
It offers thermal conductivity ≥ 0.76 W/m·K for heat dissipation, UL 94 V-0 flame retardancy, volume resistivity 1.0 × 1016 Ω·cm and dielectric strength 25–30 kV/mm, with aging resistance and moisture-proof protection over −50 °C to 250 °C.
Q5: What are the MOQ, ODM/OEM customization and delivery time?
Minimum order quantity is 1 kg, supplied as 25 kg (A) + 25 kg (B) 50 kg/set kits; free 1–2 kg samples ship in 3–5 working days and bulk orders in 7–15 days. We support ODM/OEM customization of colour, hardness, viscosity, thermal conductivity and cure speed.
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