High Transparency Shore D 80 Epoxy Potting Compound for Industrial Sensor Housing Encapsulation

HANAST HN-5506 A/B High Transparency Epoxy Potting Compound for Industrial Sensor Housing and High-Voltage Encapsulation

HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardness, low viscosity, excellent self-levelling and defoaming performance. Mixed at a 3:1 ratio by weight, it flows into fine gaps and cures into a crystal-clear, high-hardness, UV-resistant and anti-yellowing encapsulant with excellent adhesion, high dielectric strength and outstanding electrical insulation. It is well suited to encapsulating industrial and optical sensor housings and other precision electronics that require deep-gap penetration, transparent inspection and reliable high-voltage insulation.

Key Features

• High transparency with high hardness (Shore D 78-83) after cure
• Low viscosity, good flowability, excellent self-levelling and defoaming for narrow gaps
• High dielectric strength of 25 kV/mm with volume resistivity of 4.3 x 10¹⁵ ohm.cm
• UV resistant and anti-yellowing; excellent weathering resistance
• Long pot life at room temperature; one-time pouring up to 3-5 cm thickness
• Excellent adhesion and mechanical properties; low cure shrinkage
• High glass transition temperature (Tg > 90°C) and -60°C to 135°C temperature resistance
• Moisture-proof, waterproof, oil-proof and dust-proof performance
• Index-matched clarity for optical and industrial sensors
• RoHS compliant and classified as non-dangerous goods for global shipment
• Custom OEM/ODM with free samples and wholesale bulk supply

Technical Specifications

Applications

HN-5506 A/B is widely used for high-clarity encapsulation: industrial sensor housings, optical and photo sensors, proximity and liquid-level sensors, temperature and pressure sensors; high-voltage components, ignition coils and coils; LED lighting fixtures, LED display modules, indicator-light components and underwater lights; electronic component encapsulation, bonding and sealing; precision sensors and relays; display modules, label doming, crystal doming and digital tubes; and power modules. It suits electronics, sensor and optical applications that require high transparency, high hardness and gap-penetrating, self-levelling encapsulation with reliable high-voltage insulation.

Why Choose HN-5506 A/B

With crystal-clear transparency, high hardness, high dielectric strength, anti-yellowing UV resistance and a low-void, self-levelling, vacuum-degassing-friendly cure, HN-5506 A/B is one of the best potting compounds for reliable sensor and electronics protection. Hanast is a direct manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We supply free samples and wholesale bulk epoxy encapsulant across Asia and worldwide at factory-direct pricing, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific sensor, module or high-voltage design.

Packaging & Storage

Supplied as Component A (15 kg plastic drum) and Component B (5 kg plastic drum), or as custom kits. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at 5-25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 12 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone and epoxy materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including sensors, electronics, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation. Headquartered in Shenzhen, Guangdong, China, we offer free samples, custom formulation and wholesale bulk supply at factory-direct pricing.

FAQ

Q1: What is HN-5506 A/B and which applications does it suit?
A1: HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardness (Shore D 78-83), low viscosity, excellent self-levelling and high dielectric strength, designed for industrial sensor housings, high-voltage components, LED lighting, display modules and transparent electronic encapsulation.

Q2: What are the mix ratio, pot life and curing schedule?
A2: Mix Component A and Component B at a 3:1 ratio by weight. Pot life is 20-30 minutes at 25°C (150 g mix); initial cure 6-8 hours and full cure 12-16 hours at 25°C, or a heat-accelerated cure in 1 hour at 80°C. One-time pouring of up to 3-5 cm thickness at 25°C is supported with built-in defoaming.

Q3: What are the cured electrical and thermal properties?
A3: Cured hardness is Shore D 78-83; dielectric strength is 25 kV/mm; volume resistivity is 4.3 x 10¹⁵ ohm.cm and surface resistivity 2.6 x 10¹⁴ ohm; the glass transition temperature (Tg) is above 90°C and temperature resistance is -60°C to 135°C, with excellent adhesion and low cure shrinkage.

Q4: How do I get a void-free, transparent result for sensor encapsulation?
A4: It is UV resistant and anti-yellowing for prolonged light exposure. For maximum clarity, optionally vacuum-degas the mix after blending to remove entrapped air, then pour within the pot life; the low-viscosity, self-levelling formulation penetrates fine gaps and do not move or stress the part during cure.

Q5: Do you offer samples, customization and wholesale supply?
A5: Yes. We are a direct China manufacturer offering free samples and wholesale bulk supply at factory-direct pricing, with custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed. Packaging is Component A 15 kg + Component B 5 kg (custom kits available); samples ship in 3-5 working days and bulk orders in 7-15 days.