Thermal Cycling Resistant Black Epoxy Potting Compound with 5:1 Mix Ratio for Smart Meter and Charging Pile Module Encapsulation

HN-5508A/B is a two-component epoxy potting compound curing at room temperature or low temperature. Its low viscosity, 2-3 hour pot life and good fluidity let the resin fill narrow clearances and complex meter and charger housings completely. The cured compound is bubble-free, smooth and glossy with Shore D 85-95 hardness, 20-22 kV/mm dielectric strength, low shrinkage and low water absorption, and it resists humid-heat ageing and acid/alkali attack. It is RoHS compliant and classified as non-dangerous goods for transport.

• Withstands temperature cycling between -30 °C and a 130-150 °C heat distortion temperature
• Low shrinkage 0.35-0.55% for dimensional stability of precision meter and sensor assemblies
• Low water absorption below 0.03% with moisture proofing and humid-heat ageing resistance
• High dielectric strength 20-22 kV/mm for insulation of grid and charging electronics
• Bubble-free, smooth, glossy surface with Shore D 85-95 hardness
• High compressive strength 18-22 kg/cm2 and strong bonding strength
• Long 2-3 hour pot life and good fluidity for multi-cavity and mass-production potting
• RoHS compliant, room-temperature or 60-80 °C heat-accelerated cure

• Smart grid and metering: smart meters, energy meters, prepaid meters, smart grid RTUs, distribution automation terminals, concentrators and communication modules
• EV charging: AC and DC charging piles, charging modules, on-board chargers, power stacks and control boards
• Outdoor telecom: outdoor telecom and RF modules, antenna units, base station power supplies, 5G remote radio units and optical modules
• Industrial and infrastructure: security and surveillance cameras, access control units, HVAC controllers, agricultural control boxes, mining electronics and industrial control boards
• Power electronics: power modules, IGBT modules, capacitors, transformers, resistors, filters and high-voltage packages
• Automotive and sensors: automotive ECUs, temperature sensors, temperature controllers, ignition coils and relays
• General electronics: LED drivers, PCB assemblies, aquarium equipment, negative-ion generators and ultrasonic atomizers

All values are measured at 25 °C and 60% RH after the recommended cure schedule and are for reference only.

1. Pre-mix: Stir Component A thoroughly before use. If stored in a humid environment, warm gently in a low-temperature oven to restore.
2. Weighing: Accurately weigh A and B at 5:1 by weight, not by volume.
3. Mixing: Mix with a flat-bladed tool or small mixer; do not use a round stir rod without resistance. Scrape the container walls and bottom.
4. Degassing: For void-sensitive meter and charger modules, degas under vacuum to remove air introduced during mixing.
5. Pouring: Pour into the clean, dry device within the 2-3 hour pot life. High fluidity supports manual pouring and automatic dispensing/metering equipment.
6. Curing: Cure at 25 °C for 12-16 hours, or at 60-80 °C for 1.5-2 hours. Do not move or stress the part during cure.

• Component A: 25 kg plastic barrel; Component B: 5 kg plastic pot; kit: 30 kg/set
• Store sealed in a cool, dry, well-ventilated area below 25 °C, away from direct sunlight and moisture
• Shelf life: 6 months from the date of manufacture under recommended storage
• Transport: non-dangerous goods (general chemicals)

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone and epoxy materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including sensors, electronics, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation. Headquartered in Shenzhen, Guangdong, China, we offer free samples, custom formulation and wholesale bulk supply at factory-direct pricing.

A: HN-5508A/B is a two-component 5:1 black epoxy potting compound designed for outdoor and grid electronics. It suits smart meters, energy meters, smart grid RTUs, distribution automation terminals, EV charging piles, outdoor telecom and RF modules, base station power supplies, security and surveillance units, HVAC controllers, agricultural control boxes, mining electronics, LED drivers, power modules, transformers, sensors and general PCB encapsulation.

A: Mix Component A and Component B at 5:1 by weight, not by volume. Pot life is 2-3 hours for a 100 g mix at 25 C. Tack-free time is 6-8 hours at 25 C and full cure is 12-16 hours at 25 C, or 1.5-2 hours at 60-80 C for heat-accelerated cure.

A: Cured HN-5508A/B reaches Shore D 85-95, dielectric strength 20-22 kV/mm, tensile strength 16-18 kg/cm2, compressive strength 18-22 kg/cm2, shrinkage 0.35-0.55%, water absorption below 0.03%, heat distortion temperature 130-150 C and low-temperature resistance to -30 C.

A: The cured compound is moisture proof, resistant to humid-heat ageing and has good acid/alkali resistance. Low shrinkage 0.35-0.55% and water absorption below 0.03% help keep insulation and sealing stable through repeated cycling between -30 C and a 130-150 C heat distortion temperature, which suits outdoor meter cabinets and charging equipment.

A: MOQ is 1 kg. Standard packaging is a 30 kg set (Component A 25 kg plastic barrel + Component B 5 kg plastic pot). Shelf life is 6 months when stored below 25 C in sealed containers. The product is RoHS compliant, classified as non-dangerous goods for transport, and OEM/private label and free samples are available. Contact us for a quotation.