Halogen Free Clear Transparent Epoxy Potting Compound with 5:1 Mix Ratio Epoxy Encapsulant for LED Driver Protection

HN-5508AB is a two-component, halogen-free, clear transparent epoxy potting compound with a 5:1 mix ratio by weight. It is designed for potting and encapsulation of LED drivers, LED power supplies and lighting electronics where both flame safety and optical clarity matter. After curing it forms a clear, glossy, bubble-free encapsulation with Shore D 80 hardness, 20-22 kV/mm dielectric strength, water absorption below 0.03% and a -40 to 150°C service range, so boards stay insulated against moisture, dust and thermal cycling while remaining visually inspectable.

• Halogen free formulation reaching UL94 V-0 without halogenated flame retardants
• Clear, transparent cured resin for visual inspection and light transmission
• 5:1 mix ratio by weight for accurate, repeatable dispensing
• 20-22 kV/mm dielectric strength with high volume and surface resistivity
• Water absorption below 0.03% for long-term moisture protection
• Shore D 80 hardness with excellent adhesion to PCB, metal and plastic
• Service range -40 to 150°C, resistant to thermal cycling and ageing
• EU RoHS compliant, 6-month shelf life, solvent free

For potting, sealing, encapsulation protection and insulation of lighting and electronic assemblies, including:

• LED drivers
• LED power supplies
• LED modules
• LED luminaires
• LED lamps
• LED strips
• street light drivers
• panel light drivers
• high bay drivers
• aquarium and underwater lights
• stage and architectural lighting
• light engines and COB modules
• optical display modules
• digital tube displays
• photo and sensor windows
• power supply modules
• AC capacitors
• miniature transformers
• ignition coils
• ultrasonic atomizers
• negative-ion generators
• electronic controllers
• sensors and transducers
• PCB assemblies
• relay and timer modules
• smart meters
• EV on-board chargers
• BMS boards
• charging piles
• solar micro-inverters
• 5G RRU power units
• telecom equipment
• rail transit control boards
• security camera modules

Typical values; please refer to the current TDS for the grade ordered. The cured compound is halogen free and RoHS compliant.

1. Pre-mix Component A gently, avoiding air entrapment; preheat to 30-50°C in cold weather for stable flow.
2. Weigh A and B at exactly 5:1 by weight, not by volume.
3. Mix slowly with a flat-bladed tool or mixer, scraping the walls 2-3 times, to keep the resin clear and bubble free.
4. Degas under vacuum if the driver board has dense component clusters, then pour within the pot life.
5. Preheat the assembled board to 60-80°C for 1-2 hours to remove moisture before potting.
6. Cure undisturbed; do not stress the board until the resin has gelled.

• Factory-direct supply from Guangdong, China with 50 tons per month capacity
• Halogen-free, RoHS compliant formulations for EU and North American lighting markets
• TDS and MSDS for every grade, batch traceability and consistent clarity
• OEM / ODM: custom colour, hardness, viscosity, packing and private label
• Free samples, MOQ from 1 kg, export-grade leak-proof packaging

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

Q: Is HN-5508AB really halogen free?
A: Yes. HN-5508AB is formulated without halogenated flame retardants and still reaches UL94 V-0, so it meets RoHS and halogen-free procurement requirements for LED lighting and power supply manufacturers exporting to the EU and North America.

Q: Why choose a clear potting compound for LED drivers?
A: The clear, transparent cured resin allows visual inspection of solder joints, components and void-free filling after potting, while transmitting light from on-board indicators. It also keeps the light output path clean in LED modules, lamps and luminaires.

Q: What is the mix ratio and working time?
A: Mix Component A and B at 5:1 by weight, never by volume. Pot life is long enough for batch dispensing on a LED driver line; preheat Component A in cold weather to keep viscosity stable and degas the mix if the board has dense component clusters.

Q: What electrical and mechanical performance does it deliver?
A: Cured HN-5508AB provides 20-22 kV/mm dielectric strength, good volume and surface resistivity, Shore D 80 hardness, water absorption below 0.03%, and a -40 to 150 degrees C service range, protecting LED drivers against moisture, thermal cycling and vibration.

Q: What are the MOQ, packing and OEM options?
A: MOQ starts at 1 kg, standard packing is 25 kg barrel, 200 kg drum or customised A+B kits, and OEM or private-label service with custom colour, hardness and viscosity is available factory direct. TDS, MSDS and free samples are provided for evaluation.

Potting an LED driver, power supply or lighting module? Send your board drawing, potted volume and annual demand - our engineers will confirm the grade, packing and sample plan within 12 hours.