2025-10-27
Application Scenarios and Pain Points:
UV-LED light sources used in industrial printing and coating require extremely high power density. The light-emitting surface and substrate must dissipate heat efficiently and be isolated from oxygen in the air to prevent oxidation.
Solution: A 1:1 silicone sealant with high transmittance (especially in the UV-A/B bands) and excellent thermal conductivity is used for potting, integrating the LED chip, lens, and substrate into a single package.
Core Values:
Balanced Optics and Heat Dissipation: This material serves as both an optical encapsulation material and a thermal interface material, significantly improving the light output efficiency and lifespan of the UV light source.
Isolated from Oxygen: This prevents oxidation and blackening of the LED mirror surface at high temperatures, maintaining stable light decay.
Integrated Structure: This creates a solid, integrated structure, preventing lens detachment and enhancing device durability.
