2026-03-24
Low-Density Silicone Encapsulant for Aerospace and Satellite Electronics
To meet the extreme load requirements of aerospace applications, we have developed an ultra-low density, lightweight silicone adhesive. While maintaining high thermal conductivity and insulation, it is 30% lighter than conventional adhesives. It possesses excellent low-outgassing properties, preventing contamination of optical instruments in the space environment, making it a core solution for satellite component encapsulation.
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