2026-03-24
Ultra-Soft Silicone Gel for AI Sensor Encapsulation and Delicate Electronics Protection
The preferred choice for precision packaging in the AI hardware era. Our ultra-soft silicone gel possesses near-zero stress properties, encapsulating extremely fragile AI sensors, LiDAR, and camera modules like a "jelly." This material exhibits excellent self-healing capabilities and vibration damping properties, effectively preventing solder joint cracking caused by mechanical stress. Its high transparency and lack of internal stress make it an ideal solution for developers of smart wearables and autonomous driving hardware.
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