10:1 Liquid Ruber Waterproof Sealant For Electric Clear Silicone Potting Compound For Led Light Sensor PCB
Product description:
10:1 silicone potting compound is a two-component, room-temperature curing adhesive. The "10:1" ratio refers to the mixing proportions of its A and B components. It is primarily used for sealing and protecting electronic products. This type of product exhibits excellent insulation, thermal conductivity, resistance to high and low temperatures, moisture resistance, and vibration resistance, effectively protecting electronic components.
Product application:
Suitable for the electronics industry, such as protecting printed circuit boards, sensors, automotive electronic components, LED lights, etc., from moisture, dust, and mechanical stress.
Technical Parameters
|
№
|
Itrems
|
Technique Request
|
|
1
|
Appearance
|
Transparent, White, Black
Flowing Liquid
|
|
2
|
Viscosity (before curing) (mPa.S)
|
A:2000 B:50
|
|
3
|
Specific Gravity (23℃)
|
0.98
|
|
4
|
Available Time (h, 25℃)
|
1-2h
|
|
5
|
Entirely Cure Time (h, 25℃)
|
8-12h
|
|
6
|
Shaw Hardness (JIS A)
|
25A
|
|
7
|
Volume Resistivity (Ω cm)
|
≥1×1014
|
|
8
|
Strength of Breakdown Voltage (kv / mm)
|
18-25
|
|
9
|
Dielectric Constant (1MHZ)
|
2.5 - 3.0
|
|
10
|
Dielectric Loss Angle Tangent (1MHZ)
|
≤4×10-3
|
|
11
|
Thermal Conductivity (w / m.k)
|
0.1 - 0.20
|
How to use:
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
Ihre Nachricht muss zwischen 20 und 3.000 Zeichen enthalten!
