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1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

Name: 1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-100
Availability: InStock

Detail Produk:

Tempat asal:	GUANGDONG, Tiongkok
Nama merek:	Hanast
Sertifikasi:	ROHS
Nomor model:	HN-100

Informasi Rinci

Tempat asal:

GUANGDONG, Tiongkok

Nama merek:

Hanast

Sertifikasi:

ROHS

Nomor model:

HN-100

Menyoroti:

High Light

Menyoroti:

Extreme Heat Dissipation Thermal Compound Paste

High Durability Thermal Compound Paste

1.0W/M·K Thermal Compound Paste

Informasi Perdagangan

Kuantitas min Order:

1kg

Harga:

USD

Kemasan rincian:

25kg/barel

Waktu pengiriman:

5-8 hari

Syarat-syarat pembayaran:

D/a, d/p, t/t

Deskripsi Produk

1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability Product description: High thermal conductivity and insulating organic silicon material, which almost never solidifies, can remain in a paste-like state for long-term use at temperatures ranging from -40℃ to +180℃. It possesses excellent electrical insulation properties, outstanding thermal conductivity, along with a low degree of

Tag:

Powdered Thermal Paste for Constant Temperature Oven 200 Degrees Breakdown Voltage of 2450 After 8 Days of Continuous Baking

Dapatkan Harga Terbaik

Unit 1210-1211, Blok B, Bangunan 6, Hengda Fashion Valley, Jalan Dalang, Distrik Longhua, Shenzhen, Provinsi Guangdong, Cina E-mail: sales11@hanastsilicone.com Tel: +8613670122311 Tel: +8613670122311

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8613670122311

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1.0W/M·K Premium Thermal Compound Paste, High Durability & Extreme Heat Dissipation For Overclocking CPU GPU Power Module Long-Lasting Stability

High Light

Menyoroti:

Extreme Heat Dissipation Thermal Compound Paste

High Durability Thermal Compound Paste

1.0W/M·K Thermal Compound Paste

Gemuk Konduktif Termal GPU,

Gemuk Konduktif Termal 3.0 W/MK,

Gemuk Konduktif Termal Mudah Diaplikasikan

Thermal Grease 0.97± 0.1 Thermal Conductivity Viscosity 76 Density 1.85± 0.08 For Customer Requirements

Powdered Thermal Paste for Constant Temperature Oven 200 Degrees Breakdown Voltage of 2450 After 8 Days of Continuous Baking